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US 2026/0169242 A1Published application
Optical devices and methods of manufacture
OwnerChia-Ming Hung, Chi-Yuan Shih +3inventors
InventorsChia-Ming Hung, Chi-Yuan Shih, Wen-Chuan Tai, Fan Hu, Chen-Hao Huang
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Abstract
Methods of manufacturing optical devices and the optical devices formed are presented wherein method include forming a dielectric material around a wafer, forming an opening within the dielectric material, sealing the opening by bonding a stack of semiconductor materials to the dielectric material; and forming at least one optical component using the stack of semiconductor materials.
Claims20
A method of manufacturing an optical device, the method comprising:
- forming a dielectric material around a wafer;
- forming an opening within the dielectric material;
- sealing the opening by bonding a stack of semiconductor materials to the dielectric material;
- and
- forming at least one optical component using the stack of semiconductor materials.
2 more elements
A method of manufacturing an optical device, the method comprising:
- forming a buried cavity within a silicon on insulator substrate;
- forming optical components and at least one heater over a first side of the buried cavity;
- and
- forming a dielectric material on a second side of the buried cavity, wherein the buried cavity thermally isolates the at least one heater from the dielectric material.
1 more element
An optical device comprising:
- a first buried cavity within a first dielectric material;
- first optical components and a heater on a first side of the first buried cavity;
- and
- a second dielectric material on a second side of the first buried cavity opposite the first side, wherein the first buried cavity thermally isolates the second dielectric material from the heater.
1 more element
Dependencies are inferred from the claim text.