Undercut architectures for improved thermal efficiency in photonic integrated circuit (PIC) architectures
AssigneeAltera Corporation
InventorsChia-Pin Chiu, Kaveh Hosseini
Life of this patent
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Abstract
In one embodiment, a photonic integrated circuit (PIC) device includes conductive pads on a surface of the PIC and a micro ring resonator (MRR) with a heater element centrally located between the conductive pads. The PIC also includes a cavity defined within a substrate of the PIC below the MRR, and a plurality of holes defined between the MRR and the conductive pads. The holes extend from a top surface of the PIC into the cavity, and each hole is between a respective conductive pad and the MRR.
Claims20
An apparatus comprising:
- a substrate;
- one or more dielectric layers on the substrate;
- a first conductive pad on the dielectric layers;
- a second conductive pad on the dielectric layers;
- an optical circuit element in one of the dielectric layers, the optical circuit element between the first conductive pad and the second conductive pad;
- a cavity defined within the substrate below the optical circuit element;
- a first hole defined through the dielectric layers and into the cavity, the first hole formed between the first conductive pad and the optical circuit element;
- and
- a second hole defined through the dielectric layers and into the cavity, the second hole formed between the second conductive pad and the optical circuit element.
A photonic integrated circuit (PIC) device, comprising:
- conductive pads on a surface of the PIC;
- a micro ring resonator (MRR) with a heater element, wherein the MRR is centrally located between the conductive pads;
- a cavity defined within a substrate of the PIC below the MRR;
- and
- a plurality of holes defined between the MRR and the conductive pads, the plurality of holes extending from a top surface of the PIC into the cavity, each hole between a respective conductive pad and the MRR.
An integrated circuit package comprising:
- a package substrate;
- an electronic integrated circuit (EIC);
- and
- a photonic integrated circuit (PIC) coupled to the EIC, wherein the PIC comprises:
- conductive pads on a surface of the PIC;
- a micro ring resonator (MRR) with a heater element, wherein the MRR is centrally located between the conductive pads;
- a cavity defined within a substrate of the PIC below the MRR;
- and
- a plurality of holes defined between the MRR and the conductive pads, the plurality of holes extending from a top surface of the PIC into the cavity, each hole between a respective conductive pad and the MRR.
Dependencies are inferred from the claim text.