Optical module
AssigneeInnolight Technology Pte. Ltd.
InventorsLong Chen, Yuzhou Sun, Dengqun Yu
Life of this patent
Estimating the term…
Abstract
An optical module includes a housing, a heat sink apparatus arranged in and thermally connected to the housing, and a printed circuit board partially arranged on the heat sink apparatus. The optical module further includes an optoelectronic chip arranged on the heat sink apparatus. The printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface. The heat sink apparatus is connected to the second surface. The opening is located near a center of the printed circuit board. The optoelectronic chip is arranged in the opening.
Claims34
An optical module, comprising:
- a housing;
- a heat sink apparatus arranged in and thermally connected to the housing;
- and
- a printed circuit board adhered to the heat sink apparatus,
- wherein
- the optical module further comprises an optoelectronic chip arranged on the heat sink apparatus,
- the printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface,
- the heat sink apparatus is connected to the second surface,
- the opening is located near a center of the printed circuit board,
- the optoelectronic chip is arranged in the opening,
- the printed circuit board has a first end arranged with an external electrical interface, and a second end opposite to the first end, and
- the opening is spaced apart from the second end.
An optical module, comprising:
- a housing including a first housing and a second housing facing each other and connected to each other;
- a heat sink arranged between the first housing and the second housing and thermally connected to the second housing;
- and
- a printed circuit board arranged on the heat sink,
- wherein
- the optical module further comprises a first optoelectronic chip and a second optoelectronic chip, the first optoelectronic chip being arranged on the heat sink,
- the first optoelectronic chip and the second optoelectronic chip are both electrically connected to the printed circuit board, and
- the first optoelectronic chip is arranged on a first side of the heat sink facing the first housing, and the second optoelectronic chip is arranged on a second side of the heat sink facing the second housing.
An optical module, comprising:
- a housing;
- a heat sink apparatus arranged in and thermally connected to the housing;
- and
- a printed circuit board arranged on the heat sink apparatus,
- wherein
- the optical module further comprises a first optoelectronic chip and a second optoelectronic chip, the first optoelectronic chip being arranged on the heat sink apparatus,
- the printed circuit board has an external electrical interface, for realizing external electrical connections, arranged at an end of the printed circuit board, the external electrical interface including gold fingers,
- the housing includes a first housing and a second housing facing each other and connected to each other,
- the heat sink apparatus is arranged between the first housing and the second housing and thermally connected to the second housing, and
- the first optoelectronic chip is electrically connected to a first surface of the printed circuit board facing the first housing, and the second optoelectronic chip is electrically connected to a second surface of the printed circuit board facing the second housing.
Dependencies are inferred from the claim text.