G02B 6/4267
Reduction of thermal stress
Official title: {Reduction of thermal stress, e.g. by selecting thermal coefficient of materials}
G02B6/4267 (Reduction of thermal stress) appears on 150 US grants and 188 published applications in this corpus.
Search patents in G02B- Granted patents
- 150
- Published applications
- 188
- Assignees
- 122
- Inventors
- 519
- Latest grant
- 5 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 3 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 3 | 1 |
| 2002 | 6 | 11 |
| 2003 | 9 | 17 |
| 2004 | 7 | 9 |
| 2005 | 9 | 9 |
| 2006 | 4 | 6 |
| 2007 | 3 | 5 |
| 2008 | 6 | 2 |
| 2009 | 3 | 0 |
| 2010 | 2 | 4 |
| 2011 | 1 | 4 |
| 2012 | 2 | 4 |
| 2013 | 5 | 9 |
| 2014 | 9 | 5 |
| 2015 | 6 | 11 |
| 2016 | 9 | 8 |
| 2017 | 9 | 11 |
| 2018 | 8 | 6 |
| 2019 | 7 | 5 |
| 2020 | 6 | 5 |
| 2021 | 1 | 6 |
| 2022 | 2 | 9 |
| 2023 | 9 | 6 |
| 2024 | 3 | 15 |
| 2025 | 8 | 13 |
| 2026 | 6 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents
- Optoelectronic assembly and method of making the same74US 5,977,567 ALightlogic, Inc. · 1999
- Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection67US 6,953,291 B2Finisar Corporation · 2005
- Hermetically sealed optical subassembly61US 6,861,641 B1Optical Communication Products, Inc. · 2005
- Pull detach mechanism for fiber optic transceiver module56US 6,746,158 B2Agilent Technologies, Inc. · 2004
- Optical semiconductor module, its manufacture, reflection film, its manufacture, and laser and optical devices using reflection film44US 6,448,583 B1Fujitsu Limited · 2002