US 12,601,874 B2Granted

Managing temperatures in integrated circuits

AssigneeCiena Corporation

InventorsRaphael Beaupré-Laflamme, Lam Nguyen

Life of this patent

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Abstract

An article of manufacture comprises: a first integrated circuit, with a cavity formed through an entire thickness between a first surface of the first integrated circuit and a second surface of the first integrated circuit; a second integrated circuit having a size such that at least a portion of the second integrated circuit fits within at least a portion of the cavity; and a thermally conductive structure mechanically connected to the second surface of the first integrated circuit and mechanically connected to a surface of the second integrated circuit. A feature of the first integrated circuit and a feature of the second integrated circuit are positioned at respective distances from a reference plane intersecting a portion of the thermally conductive structure, such that the distances remain substantially equal to each other at each of a plurality of temperatures within a predetermined operating temperature range.

Claims17

Dependent claims

An article of manufacture, comprising:

a first integrated circuit comprising a first surface and a second surface, with a cavity formed through an entire thickness, along a first axis, between the first surface of the first integrated circuit and the second surface of the first integrated circuit;
a second integrated circuit comprising a first surface and a second surface and having a size such that at least a portion of the second integrated circuit fits within at least a portion of the cavity;
and
a plug structure connected to the second surface of the first integrated circuit and connected to the second surface of the second integrated circuit;
where a feature of the first integrated circuit and a feature of the second integrated circuit are positioned at respective distances from a reference plane intersecting a portion of the plug structure, such that the distances remain substantially equal to each other at each of a plurality of temperatures within a predetermined operating temperature range;
and
where the feature of the first integrated circuit comprises a first waveguide, and the feature of the second integrated circuit comprises a second waveguide.

4 more elements

A method, comprising:

forming a cavity through a first integrated circuit comprising a first surface and a second surface, with the cavity formed through an entire thickness, along a first axis, between the first surface of the first integrated circuit and the second surface of the first integrated circuit;
receiving a second integrated circuit comprising a first surface and a second surface and having a size such that at least a portion of the second integrated circuit fits within at least a portion of the cavity;
and
connecting a plug structure to the second surface of the first integrated circuit and to the second surface of the second integrated circuit;
where a feature of the first integrated circuit and a feature of the second integrated circuit are positioned at respective distances from a reference plane intersecting a portion of the plug structure, such that the distances remain substantially equal to each other at each of a plurality of temperatures within a predetermined operating temperature range;
and
where the feature of the first integrated circuit comprises a first waveguide, and the feature of the second integrated circuit comprises a second waveguide.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/173,301Filed 23 Feb 2023
Published: US 2024/0288633 A129 Aug 2024
Granted: 14 Apr 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification6 codes

G02B 6/13
Of the integrated circuit kind: integrated optical circuits characterised by the manufacturing method
G02B 6/12
Of the optical waveguide type: of the integrated circuit kind
G02B 6/4239
Fixing or mounting methods of the aligned elements: adhesive bonding; Encapsulation with polymer material
G02B 6/4269
Cooling: with heat sinks or radiation fins