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US 12,704,677 B2Granted
Optoelectronic package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChun-Yen Ting, Hung-Chun Kuo, Jung Jui Kang, Chiu-Wen Lee, Shih-Yuan Sun
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Abstract
An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.
Claims7
An optoelectronic package, comprising:
- a photonic structure including an upper surface and a waveguide embedded therein and disposed adjacent to the upper surface, wherein the waveguide has a first port exposed from the upper surface and configured to couple an optical signal, and a second port opposite to the first port and exposed from the upper surface;
- a component fixing a light transmission channel and aligning the light transmission channel with the first port of the waveguide through a plurality of alignment pads on the component, wherein the light transmission channel includes a light communication port aligned with the first port of the waveguide;
- a coupling material disposed between the light communication port and the first port of the waveguide;
- and
- an optoelectronic component coupled with the second port of the waveguide, wherein the optoelectronic component horizontally overlaps the light communication port of the light transmission channel and the coupling material.
2 more elements
An optoelectronic package, comprising:
- a carrier including a first surface;
- a photonic structure disposed on the first surface of the carrier and including an optical I/O, wherein the photonic structure has an upper surface, a lower surface opposite to the upper surface, and a lateral surface extending between the upper surface and the lower surface, wherein the optical I/O is exposed from the lateral surface, and the optical I/O includes an optical surface aligned with the lateral surface of the photonic structure;
- a component aligning a light transmission channel with the optical I/O of the photonic structure in a first direction that is substantially parallel to the first surface of the carrier, wherein the light transmission channel includes a light communication port horizontally aligned with the optical I/O of the photonic structure, and wherein the optical surface of the optical I/O faces the light transmission channel;
- a coupling material disposed between the light communication port and the optical I/O and vertically overlapping a portion of the carrier;
- and
- a plurality of connectors connecting a plurality of alignment pads of the component to a plurality of bonding pads exposed from the lateral surface of the photonic structure, wherein the coupling material vertically overlaps the plurality of connectors.
3 more elements
Dependencies are inferred from the claim text.