Receptacle for connecting parallel fiber optic cables to a multichip module

Abstract

A fiber optic receptacle for connecting standard fiber optic cable plug connectors with a multi-chip circuit module includes a surrounding non-insulative jacket having a thermal expansion joint. The jacket is preferably disposed in a recess along the edge of the multi-chip module substrate and is affixed thereto by means of solder ball technology so as to provide alignment and connection to grounding conductors. Internal fiber optic cables extend from the bottom of a recess in a receiving body which is surrounded by the non-insulative jacket. These internal optical fibers are coupled to fiber optic cables in an external plug connector with photonic receptors being present on selected circuit chips disposed on the multi-chip module structure. The connector structure solves problems of alignment, manufacturability, thermal expansion, bandwidth and compatibility in addition to problems associated with the dissipation of accumulated static charge.

Dependencies are inferred from the claim text.