G01R 31/3173
Marginal testing
G01R31/3173 (Marginal testing) appears on 63 US grants and 55 published applications in this corpus.
Search patents in G01R- Granted patents
- 63
- Published applications
- 55
- Assignees
- 42
- Inventors
- 126
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 2 |
| 2004 | 2 | 6 |
| 2005 | 3 | 6 |
| 2006 | 6 | 2 |
| 2007 | 0 | 2 |
| 2008 | 3 | 1 |
| 2009 | 2 | 0 |
| 2010 | 1 | 1 |
| 2011 | 2 | 2 |
| 2012 | 2 | 3 |
| 2013 | 3 | 4 |
| 2014 | 3 | 3 |
| 2015 | 3 | 2 |
| 2016 | 2 | 2 |
| 2017 | 2 | 2 |
| 2018 | 2 | 1 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 4 |
| 2022 | 2 | 2 |
| 2023 | 1 | 4 |
| 2024 | 4 | 1 |
| 2025 | 3 | 0 |
| 2026 | 1 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Die-to-die connectivity monitoring2 Jun 2026US 12,644,924 B2Proteantecs Ltd.
- System on chip including a PVT sensor and corresponding PVT sensing method9 Sep 2025US 12,411,169 B2STMicroelectronics S,r.l.
- Integrated circuit margin measurement for structural testing4 Mar 2025US 12,241,933 B2Proteantecs Ltd.
- System and method for parallel testing of electronic device21 Jan 2025US 12,203,982 B2STMicroelectronics International N. V.
- System testing using partitioned and controlled noise24 Dec 2024US 12,174,251 B2International Business Machines Corporation
- Die-to-die connectivity monitoring24 Sep 2026US 2026/0287651 A1Proteantecs Ltd.
- Integrated circuit margin measurement for structural testing3 Sep 2026US 2026/0259261 A1Proteantecs Ltd.
- Generation method for chip internal voltage prediction model, prediction method and related apparatus16 Jul 2026US 2026/0203640 A1Hygon Information Technology Co., Ltd.
- Temperature-aware built-in self-test (bist) control system for selectively controlling activation of bist circuits in a processor-based system to maintain temperature limit, and related methods26 Mar 2026US 2026/0086144 A1QUALCOMM Incorporated
- Die-to-die connectivity monitoring28 Nov 2024US 2024/0393390 A1Proteantecs Ltd.
Most cited
By later US patents
- Method for dynamic bandwidth testing81US 5,970,052 AInternational Business Machines Corporation · 1999
- Built in self repair for DRAMs using on-chip temperature sensing and heating47US 5,956,350 AHeuristic Physics Laboratories, Inc. · 1999
- Circuit simulation method with clock event suppression for debugging LSI circuits37US 4,899,273 AHitachi, Ltd. · 1990
- Burn-in system for reliable integrated circuit manufacturing28US 6,157,201 ASun Microsystems, Inc. · 2000
- Non-destructive method of detecting die crack problems27US 6,449,748 B1LSI Logic Corporation · 2002