Built in self repair for DRAMs using on-chip temperature sensing and heating
AssigneesLSI Logic Corporation, Heuristic Physics Laboratories, Inc.
InventorsV. Swamy Irrinki, Yervant D. Lepejian
Life of this patent
Estimating the term…
Loading patent…
AssigneesLSI Logic Corporation, Heuristic Physics Laboratories, Inc.
InventorsV. Swamy Irrinki, Yervant D. Lepejian
Estimating the term…
A memory device which tests the memory array under typical operating conditions. In one embodiment, the memory device incorporates a heating element to heat the memory array to a predetermined operating temperature, and a BIST (built-in self test) unit to test the memory array at the predetermined operating temperature. This may advantageously provide a method for detecting and repairing faulty memory locations that would not normally test faulty under initial power-up conditions. Broadly speaking, the present invention contemplates a memory device which comprises a memory array and a heating element on a substrate. The memory array is configured to receive a read/write signal on a read/write line, configured to receive an address on an address bus, configured to provide data to a data bus when the read/write signal indicates a read operation, and configured to store data from the data bus when the read/write signal indicates a write operation. The data on the data bus is stored in a memory location indicated by the address on the address bus. The heating element is coupled to the substrate to heat the memory array to a predetermined operating temperature. The memory device may further include a temperature sensor coupled to the substrate and configured to provide a temperature signal indicative of a temperature of the memory array, and a heating control coupled to receive the temperature signal and coupled to responsively regulate power to the heating element.
A memory device which comprises:
A method for on-chip testing and repairing of memories in a system that contains a heating element, a test circuit, a repair circuit, a memory array, and a plurality of redundant memory locations within the memory array, the method comprising the steps of:
An on-chip system for detecting and repairing data retention faults under normal operating conditions, wherein the system comprises:
An on-chip system for detecting and repairing data retention faults, wherein the system comprises:
Dependencies are inferred from the claim text.