G01R 31/2831
Testing of materials or semi-finished products
Official title: {Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates (G01R31/318511 takes precedence; testing during manufacture H10P74/00)}
G01R31/2831 (Testing of materials or semi-finished products) appears on 1,182 US grants and 956 published applications in this corpus.
Search patents in G01R- Granted patents
- 1,182
- Published applications
- 956
- Assignees
- 465
- Inventors
- 2,427
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 4 | 0 |
| 1982 | 4 | 0 |
| 1983 | 0 | 0 |
| 1984 | 7 | 0 |
| 1985 | 5 | 0 |
| 1986 | 5 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 6 | 0 |
| 1990 | 7 | 0 |
| 1991 | 15 | 0 |
| 1992 | 10 | 0 |
| 1993 | 10 | 0 |
| 1994 | 11 | 0 |
| 1995 | 14 | 0 |
| 1996 | 25 | 0 |
| 1997 | 36 | 0 |
| 1998 | 30 | 0 |
| 1999 | 33 | 0 |
| 2000 | 42 | 0 |
| 2001 | 39 | 9 |
| 2002 | 53 | 46 |
| 2003 | 38 | 48 |
| 2004 | 51 | 45 |
| 2005 | 39 | 55 |
| 2006 | 53 | 49 |
| 2007 | 45 | 47 |
| 2008 | 30 | 25 |
| 2009 | 24 | 21 |
| 2010 | 30 | 17 |
| 2011 | 15 | 15 |
| 2012 | 13 | 10 |
| 2013 | 13 | 10 |
| 2014 | 12 | 21 |
| 2015 | 17 | 29 |
| 2016 | 15 | 18 |
| 2017 | 15 | 22 |
| 2018 | 24 | 44 |
| 2019 | 41 | 59 |
| 2020 | 61 | 72 |
| 2021 | 60 | 70 |
| 2022 | 60 | 52 |
| 2023 | 64 | 50 |
| 2024 | 34 | 45 |
| 2025 | 30 | 50 |
| 2026 | 28 | 27 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier-resolved hall measurement with multi-harmonic magnetoresistance analysis22 Sep 2026US 12,742,812 B2International Business Machines Corporation
- Test circuit having separately arranged digital and analog circuits for testing a device under test8 Sep 2026US 12,730,145 B2Techwidu Co., Ltd.
- Wafer test cassette, wafer test system and wafer test method1 Sep 2026US 12,724,064 B2Xingr Technologies (Zhejiang) Limited
- Manufacturing automatic test equipment and field ambient comparison with silicon lifecycle management support1 Sep 2026US 12,724,065 B1Synopsys, Inc.
- Systems and methods for carving probed metrology18 Aug 2026US 12,710,466 B2Arizona Board of Regents on behalf of Arizona State University
- Test circuit and method for operating the same17 Sep 2026US 2026/0276697 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Method and system for thermal control of devices in an electronics tester17 Sep 2026US 2026/0276734 A1Aehr Test Systems
- Carrier, inspection system, and inspection method3 Sep 2026US 2026/0259256 A1Tokyo Electron Limited
- Thermal donor quantity prediction method and apparatus using lifetime of silicon wafer27 Aug 2026US 2026/0251694 A1SK Siltron Co., Ltd.
- Through-silicon via (tsv) batch testing27 Aug 2026US 2026/0251725 A1Micron Technology, Inc.
Most cited
By later US patents
- Method and apparatus for integrated wafer handling and testing404US 6,164,894 A2000
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Method and apparatus for wireless radio frequency testing of RFID integrated circuits290US 6,236,223 B1Intermec IP Corp. · 2001
- Method of making a flexible tester surface for testing integrated circuits253US 5,020,219 A1991
- Method for forming an interconnect having a penetration limited contact structure for establishing a temporary electrical connection with a semiconductor die241US 5,686,317 AMicron Technology, Inc. · 1997