C23F 3/04
Heavy metals
C23F3/04 (Heavy metals) appears on 250 US grants and 339 published applications in this corpus.
Search patents in C23F- Granted patents
- 250
- Published applications
- 339
- Assignees
- 148
- Inventors
- 723
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 4 |
| 2002 | 5 | 10 |
| 2003 | 12 | 19 |
| 2004 | 8 | 15 |
| 2005 | 9 | 38 |
| 2006 | 10 | 35 |
| 2007 | 13 | 34 |
| 2008 | 18 | 17 |
| 2009 | 11 | 26 |
| 2010 | 7 | 14 |
| 2011 | 18 | 6 |
| 2012 | 9 | 5 |
| 2013 | 10 | 8 |
| 2014 | 9 | 8 |
| 2015 | 4 | 14 |
| 2016 | 7 | 9 |
| 2017 | 13 | 17 |
| 2018 | 8 | 6 |
| 2019 | 9 | 10 |
| 2020 | 7 | 6 |
| 2021 | 4 | 10 |
| 2022 | 2 | 3 |
| 2023 | 6 | 6 |
| 2024 | 5 | 6 |
| 2025 | 2 | 8 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing ceramic circuit board30 Jun 2026US 12,667,900 B2Niterra Materials Co., Ltd.
- Compound, CMP slurry composition including the same and polishing method using the same16 Jun 2026US 12,655,321 B2Samsung SDI.Co., Ltd.
- Functionalized carbon particle CMP slurry16 Jun 2026US 12,655,322 B2DuPont Electronic Materials Holding, Inc.
- Slurry composition for metal polishing2 Jun 2026US 12,644,017 B2Kctech Co., Ltd.
- Planarized membrane and methods for substrate processing systems24 Feb 2026US 12,558,757 B2ASM America, Inc.
- Composition and method for cmp of metal films16 Jul 2026US 2026/0201228 A1Versum Materials US, LLC
- Planarized membrane and methods for substrate processing systems18 Jun 2026US 2026/0166672 A1ASM America, Inc.
- Cmp slurry composition for polishing copper layer and method of polishing copper layer using the same11 Jun 2026US 2026/0159736 A1Samsung SDI.Co., Ltd.
- Chemical polishing bath for titanium and titanium alloys, and method using such a bath21 May 2026US 2026/0139156 A1Institut De Recherche Technologique Materiaux Metallurgie Et Procedes
- Medical Device Polishing Member and Manufacturing Method Therefor12 Feb 2026US 2026/0041547 A1Biotyx Medical (Shenzhen) Co., Ltd.
Most cited
By later US patents
- Chemical mechanical polishing slurry useful for copper substrates281US 5,954,997 ACabot Corporation · 1999
- Polishing method139US 6,117,775 AHitachi, Ltd. · 2000
- Post clean treatment composition comprising an organic acid and hydroxylamine137US 5,981,454 AEKC Technology, Inc. · 1999
- Copper-based metal polishing solution and method for manufacturing semiconductor device112US 5,575,885 AKabushiki Kaisha Toshiba · 1996
- Chemical polishing process for titanium and titanium alloy surgical implants90US 4,704,126 ARichards Medical Company · 1987