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US 2026/0166672 A1Published application
Planarized membrane and methods for substrate processing systems
AssigneeASM America, Inc.
InventorDaniel Ray Trojan
Life of this patent
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Abstract
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in chemical mechanical planarization of a wafer. The method further includes finishing the surface of a wafer with the planarized membrane.
Claims20
A conditioning tool for planarizing a resilient membrane for a substrate carrier, the conditioning tool comprising:
- a plate having a first surface configured to receive the resilient membrane, wherein moving contact between the first surface of the plate and the resilient membrane planarizes the resilient membrane;
- an arm configured to press the resilient membrane against the first surface of the plate during planarization;
- and
- one or more rollers configured to secure the resilient membrane to the arm during the planarization.
1 more element
A method for processing a resilient membrane for a substrate carrier, the method comprising:
- providing the resilient membrane;
- providing a membrane conditioning tool;
- and
- applying the membrane conditioning tool to the resilient membrane to planarize a surface of the resilient membrane.
1 more element
Dependencies are inferred from the claim text.