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US 12,655,321 B2Granted
Compound, CMP slurry composition including the same and polishing method using the same
AssigneeSamsung SDI Co., Ltd.
InventorsSe Young Choi, Yong Goog Kim, Soo Yeon Sim, Ja Young Hwang, Jeong Hee Kim, Youn Jin Cho
Life of this patent
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Abstract
A compound or a salt thereof, a CMP slurry composition including the same, and a polishing method using the same, the compound being represented by Formula 1,
Claims11
A CMP slurry composition, comprising:
- a polar solvent or a non-polar solvent;
- an abrasive agent;
- and
- a corrosion inhibitor,
- wherein the corrosion inhibitor includes a compound represented by Formula 1, or a salt thereof,
- wherein, in Formula 1,
- AZ1 and AZ2 are each independently a substituted or unsubstituted azole-containing heterocyclic group;
- R1 and R2 are each independently hydrogen, a substituted or unsubstituted C1 to C10 alkyl group, a substituted or unsubstituted C6 to C20 aryl group, a substituted or unsubstituted C7 to C20 arylalkyl group, or a substituted or unsubstituted C3 to C20 heteroaryl group;
- and
- n and m are each independently an integer of 0 to 2.
7 more elements
Dependencies are inferred from the claim text.