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US 12,644,017 B2Granted
Slurry composition for metal polishing
AssigneeKctech Co., Ltd.
InventorsJin Sook Hwang, Hyun Goo Kong, Yun Su Kim
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Abstract
The present invention relates to a slurry composition for metal polishing, comprising: colloidal silica; and an oxidizing agent; and at least one selected from among a polishing catalyst, a metal polishing enhancer, a polishing inhibitor, and a dishing and erosion reducer, wherein the colloidal silica has a particle size distribution of colloidal silica according to equation 1.
Claims16
A slurry composition for metal polishing, comprising:
- colloidal silica;
- and
- an oxidizing agent;
- and
- at least one among a polishing catalyst, a metal polishing enhancer, a polishing inhibitor, and a dishing and erosion reducer,
- wherein the colloidal silica has a particle size distribution according to Equation 1 shown below:
- 1.
- <
- K
- <
- 3.
- [
- Equation
-
- l
- ]
- (K in Equation 1 is represented by Equation 2 shown below.)
- K
- =
- (
- B
- /
- A
- )
- [
- Equation
-
- 2
- ]
- (In Equation 2, A denotes an average particle size of colloidal silica within a depth of 50 millimeters (mm) from the top of the slurry composition for metal polishing put into a measuring cylinder with a tube having an internal diameter of 80 mm and a length of 500 mm, and B denotes an average particle size of colloidal silica within a height of 50 mm from the bottom of the measuring cylinder).
27 more elements
Dependencies are inferred from the claim text.