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US 12,558,757 B2Granted
Planarized membrane and methods for substrate processing systems
AssigneeASM America, Inc.
InventorDaniel Ray Trojan
Life of this patent
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Abstract
A method and a system for planarizing a membrane is disclosed. In one aspect, the method includes providing a resilient membrane and planarizing the surface of the membrane with a conditioning tool. The planarized membrane may be used in chemical mechanical planarization of a wafer. The method further includes finishing the surface of a wafer with the planarized membrane.
Claims13
A method for processing a resilient membrane for a substrate carrier, the method comprising:
- providing the resilient membrane;
- stretching the resilient membrane around a temporary membrane holder;
- and
- planarizing a surface of the resilient membrane while the resilient membrane is stretched to form a planarized resilient membrane.
1 more element
A method for processing a resilient membrane for a substrate carrier, the method comprising:
- providing the resilient membrane;
- stretching the resilient membrane around a membrane assembly comprising a support plate and a holding element;
- and
- planarizing a surface of the resilient membrane while the resilient membrane is stretched to form a planarized resilient membrane.
1 more element
Dependencies are inferred from the claim text.