C23F 3/06
With acidic solutions
Official title: with acidic solutions
C23F3/06 (With acidic solutions) appears on 184 US grants and 237 published applications in this corpus.
Search patents in C23F- Granted patents
- 184
- Published applications
- 237
- Assignees
- 115
- Inventors
- 555
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 4 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 3 |
| 2002 | 3 | 9 |
| 2003 | 10 | 17 |
| 2004 | 7 | 11 |
| 2005 | 8 | 32 |
| 2006 | 7 | 20 |
| 2007 | 10 | 23 |
| 2008 | 10 | 13 |
| 2009 | 7 | 19 |
| 2010 | 7 | 11 |
| 2011 | 11 | 5 |
| 2012 | 7 | 3 |
| 2013 | 8 | 6 |
| 2014 | 8 | 5 |
| 2015 | 2 | 10 |
| 2016 | 3 | 5 |
| 2017 | 7 | 9 |
| 2018 | 5 | 2 |
| 2019 | 8 | 6 |
| 2020 | 1 | 3 |
| 2021 | 3 | 6 |
| 2022 | 2 | 2 |
| 2023 | 3 | 4 |
| 2024 | 4 | 4 |
| 2025 | 2 | 6 |
| 2026 | 4 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing ceramic circuit board30 Jun 2026US 12,667,900 B2Niterra Materials Co., Ltd.
- Slurry composition for metal polishing2 Jun 2026US 12,644,017 B2Kctech Co., Ltd.
- CMP slurry composition for polishing copper and copper film polishing method using the same3 Feb 2026US 12,540,256 B2Samsung SDI.Co., Ltd.
- Barrier chemical mechanical planarization slurries for cobalt films6 Jan 2026US 12,516,421 B2Versum Materials US, LLC
- Composition for tungsten CMP18 Nov 2025US 12,473,457 B2CMC Materials, Inc.
- Composition and method for cmp of metal films16 Jul 2026US 2026/0201228 A1Versum Materials US, LLC
- Chemical polishing bath for titanium and titanium alloys, and method using such a bath21 May 2026US 2026/0139156 A1Institut De Recherche Technologique Materiaux Metallurgie Et Procedes
- Medical Device Polishing Member and Manufacturing Method Therefor12 Feb 2026US 2026/0041547 A1Biotyx Medical (Shenzhen) Co., Ltd.
- Composition, method of treating metal-containing film by using the same, and method of preparing semiconductor device by using the composition28 Aug 2025US 2025/0270446 A1Samsung Electronics Co., Ltd.
- Molybdenum polishing composition21 Aug 2025US 2025/0263583 A1Fujimi Incorporated
Most cited
By later US patents
- Chemical mechanical polishing slurry useful for copper substrates281US 5,954,997 ACabot Corporation · 1999
- Polishing method139US 6,117,775 AHitachi, Ltd. · 2000
- Post clean treatment composition comprising an organic acid and hydroxylamine137US 5,981,454 AEKC Technology, Inc. · 1999
- Copper-based metal polishing solution and method for manufacturing semiconductor device112US 5,575,885 AKabushiki Kaisha Toshiba · 1996
- Chemical polishing process for titanium and titanium alloy surgical implants90US 4,704,126 ARichards Medical Company · 1987