C23C 18/1889
With use of metal first
Official title: {with use of metal first}
C23C18/1889 (With use of metal first) appears on 106 US grants and 129 published applications in this corpus.
Search patents in C23C- Granted patents
- 106
- Published applications
- 129
- Assignees
- 117
- Inventors
- 359
- Latest grant
- 1 Oct 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 2 |
| 2002 | 3 | 3 |
| 2003 | 4 | 6 |
| 2004 | 4 | 7 |
| 2005 | 2 | 6 |
| 2006 | 2 | 7 |
| 2007 | 2 | 7 |
| 2008 | 1 | 5 |
| 2009 | 4 | 6 |
| 2010 | 3 | 4 |
| 2011 | 3 | 7 |
| 2012 | 2 | 2 |
| 2013 | 1 | 5 |
| 2014 | 2 | 3 |
| 2015 | 6 | 4 |
| 2016 | 4 | 11 |
| 2017 | 4 | 10 |
| 2018 | 5 | 3 |
| 2019 | 3 | 7 |
| 2020 | 5 | 4 |
| 2021 | 3 | 3 |
| 2022 | 4 | 5 |
| 2023 | 3 | 4 |
| 2024 | 2 | 4 |
| 2025 | 0 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electroless plating method for metal gate fill1 Oct 2024US 12,107,150 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for the fabrication of an electroless-metal-plated sulfur nanocomposite, an electroless-metal-plated sulfur cathode which is made from the nanocomposite, and a battery that uses the cathode28 May 2024US 11,996,551 B2National Cheng Kung University
- Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom12 Sep 2023US 11,753,722 B2Jeonju University Office of Industry-University Cooperation
- Electroless plating method for metal gate fill11 Jul 2023US 11,699,740 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Composites and methods of making composite materials23 May 2023US 11,657,925 B2Hamilton Sundstrand Corporation
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201740 A1Wolfspeed, Inc.
- Method of Metallization by a Nickel or Cobalt Alloy for the Manufacture of Semiconductor Devices13 Feb 2025US 2025/0051927 A1
- Electroless Plating Method for Metal Gate Fill21 Nov 2024US 2024/0387690 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Selective electroless plating process for metal conductors94US 5,167,992 AMicroelectronics and Computer Technology Corporation · 1992
- Printable electric circuits, electronic components and method of forming the same57US 7,902,639 B2Siluria Technologies, Inc. · 2011
- Catalyst composition for forming electroless plating on ceramics37US 4,622,069 AOkuno Chemical Industry Co., Ltd. · 1986
- Thin films containing metallic copper and silver by replacement without subsequent accelerated oxidation19US 3,993,845 APPG Industries, Inc. · 1976