Method of preparing nanocomposite material plated with network-type metal layer through silica self-cracks and wearable electronics carbon fiber prepared therefrom

A method of preparing a composite material plated with a nano metal layer network through silica self-cracks, the method comprising:

• forming the silica self-cracks by applying a silica coating solution on a substrate comprising carbon fiber and having a curved surface, the carbon fiber having a specimen length of 60 mm, and after the applying the silica coating solution, drying to form the silica self-cracks having random crack directions and sizes on the surface of the substrate;
• performing an electroless copper plating process on the surface of the substrate on which the silica self-cracks are formed;
• and
• performing an etching process to remove the silica from the surface of the substrate after the electroless copper plating process, and forming the composite material plated with the nano metal layer network,
• wherein in the forming of the silica self-cracks, the silica coating solution is applied at a coating speed of about 50 mm/min and the drying is performed at a drying temperature of about 60° C., and after the silica coating solution is applied an the silica is dried, the applied silica has an average thickness of 1.81 μm and an average interval of the silica self-cracks is 2.07 μm,
• wherein the electroless copper plating process is performed for a plating time of about 20 minutes,
• wherein the etching process is performed using KOH as an etching solution having a concentration of about 2 mol and an etching time of about 24 hours.

A method of preparing a composite material plated with a nano metal layer network through silica self-cracks, the method comprising:

• forming the silica self-cracks by applying a silica coating solution on a substrate comprising carbon fiber and having a curved surface, the carbon fiber having a specimen length of 60 mm, and after the applying the silica coating solution, drying to form the silica self-cracks having random crack directions and sizes on the surface of the substrate;
• performing an electroless copper plating process on the surface of the substrate on which the silica self-cracks are formed;
• and
• performing an etching process to remove the silica from the surface of the substrate after the electroless copper plating process, and forming the composite material plated with the nano metal layer network,
• wherein in the forming of the silica self-cracks, the silica coating solution is applied at a coating speed of 50 mm/min and the drying is performed at a drying temperature of 60° C.,
• wherein the electroless copper plating process is performed for a plating time of 20 minutes,
• wherein the etching process is performed using KOH as an etching solution having a concentration of 2 mol and an etching time of 24 hours.