C23C 18/1872
By chemical pretreatment
Official title: {by chemical pretreatment}
C23C18/1872 (By chemical pretreatment) appears on 528 US grants and 664 published applications in this corpus.
Search patents in C23C- Granted patents
- 528
- Published applications
- 664
- Assignees
- 378
- Inventors
- 1,582
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 1 | 0 |
| 1978 | 4 | 0 |
| 1979 | 4 | 0 |
| 1980 | 4 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 6 | 0 |
| 1984 | 11 | 0 |
| 1985 | 4 | 0 |
| 1986 | 3 | 0 |
| 1987 | 10 | 0 |
| 1988 | 5 | 0 |
| 1989 | 12 | 0 |
| 1990 | 12 | 0 |
| 1991 | 5 | 0 |
| 1992 | 7 | 0 |
| 1993 | 2 | 0 |
| 1994 | 4 | 0 |
| 1995 | 10 | 0 |
| 1996 | 5 | 0 |
| 1997 | 4 | 0 |
| 1998 | 4 | 0 |
| 1999 | 8 | 0 |
| 2000 | 0 | 0 |
| 2001 | 7 | 3 |
| 2002 | 10 | 12 |
| 2003 | 6 | 22 |
| 2004 | 12 | 28 |
| 2005 | 11 | 43 |
| 2006 | 9 | 35 |
| 2007 | 8 | 29 |
| 2008 | 12 | 25 |
| 2009 | 19 | 29 |
| 2010 | 14 | 28 |
| 2011 | 11 | 29 |
| 2012 | 23 | 19 |
| 2013 | 16 | 21 |
| 2014 | 22 | 31 |
| 2015 | 18 | 48 |
| 2016 | 23 | 48 |
| 2017 | 27 | 40 |
| 2018 | 31 | 26 |
| 2019 | 26 | 48 |
| 2020 | 25 | 28 |
| 2021 | 28 | 15 |
| 2022 | 9 | 15 |
| 2023 | 13 | 17 |
| 2024 | 7 | 13 |
| 2025 | 6 | 8 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing apparatus and substrate processing method3 Mar 2026US 12,564,868 B2Tokyo Electron Limited
- Bendable nickel plating on flexible substrates17 Feb 2026US 12,553,134 B2MacDermid Enthone Inc.
- Tin oxide multilayer film with catalyst layer and method for forming same4 Nov 2025US 12,458,961 B2Panasonic Intellectual Property Management Co., Ltd.
- Structure with conductive pattern and method for manufacturing same29 Jul 2025US 12,376,230 B2Asahi Kasei Kabushiki Kaisha
- Method for selective metallisation of inorganic dielectrics or semiconductors17 Jun 2025US 12,336,114 B2Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Bendable Nickel Plating on Flexible Substrates21 May 2026US 2026/0139380 A1
- Systems and Methods for Deposition of Adhesion Augmented Atomic Palladium15 Jan 2026US 2026/0015732 A1LQDX, Inc.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- High resolution patterning on solid substrates236US 5,079,600 A1992
- Measurement techniques for controlling aspects of a electroless deposition process232US 7,465,358 B2APPLIED Materials.Inc. · 2008