C23C 18/1875
Only one step pretreatment
Official title: {only one step pretreatment}
C23C18/1875 (Only one step pretreatment) appears on 229 US grants and 305 published applications in this corpus.
Search patents in C23C- Granted patents
- 229
- Published applications
- 305
- Assignees
- 191
- Inventors
- 714
- Latest grant
- 3 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 3 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 5 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 5 | 8 |
| 2003 | 2 | 14 |
| 2004 | 4 | 14 |
| 2005 | 6 | 17 |
| 2006 | 5 | 11 |
| 2007 | 3 | 12 |
| 2008 | 4 | 13 |
| 2009 | 6 | 14 |
| 2010 | 6 | 9 |
| 2011 | 7 | 11 |
| 2012 | 11 | 15 |
| 2013 | 7 | 9 |
| 2014 | 10 | 20 |
| 2015 | 10 | 20 |
| 2016 | 11 | 22 |
| 2017 | 15 | 16 |
| 2018 | 12 | 13 |
| 2019 | 11 | 26 |
| 2020 | 13 | 10 |
| 2021 | 12 | 6 |
| 2022 | 4 | 7 |
| 2023 | 6 | 5 |
| 2024 | 3 | 5 |
| 2025 | 3 | 4 |
| 2026 | 2 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing apparatus and substrate processing method3 Mar 2026US 12,564,868 B2Tokyo Electron Limited
- Bendable nickel plating on flexible substrates17 Feb 2026US 12,553,134 B2MacDermid Enthone Inc.
- Tin oxide multilayer film with catalyst layer and method for forming same4 Nov 2025US 12,458,961 B2Panasonic Intellectual Property Management Co., Ltd.
- Structure with conductive pattern and method for manufacturing same29 Jul 2025US 12,376,230 B2Asahi Kasei Kabushiki Kaisha
- Sealing article comprising metal coating, method of making and method of using the same18 Feb 2025US 12,227,839 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Bendable Nickel Plating on Flexible Substrates21 May 2026US 2026/0139380 A1
- Systems and Methods for Deposition of Adhesion Augmented Atomic Palladium15 Jan 2026US 2026/0015732 A1LQDX, Inc.
- Catalyst for water electrolysis using fluorine-doped tin oxide support and method for manufacturing the same30 Oct 2025US 2025/0333846 A1Korea Basic Science Institute
- Tin oxide multilayer film with catalyst layer and method for forming same22 May 2025US 2025/0161928 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- High resolution metal patterning of ultra-thin films on solid substrates103US 5,077,085 A1991
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987
- Selective deposition of copper95US 4,574,095 AInternational Business Machines Corporation · 1986
- Electroless deposition employing laser-patterned masking layer90US 4,865,873 AGeneral Electric Company · 1989