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US 4,574,095 AGranted
Selective deposition of copper
AssigneeInternational Business Machines Corporation
InventorsThomas H. Baum, Frances A. Houle, Carol R. Jones, Caroline A. Kovac
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Abstract
A process for selectively depositing copper by first selectively depositing palladium seeds by irradiating a palladium compound with light. Following the deposition of the palladium seeds, copper is deposited by an electroless process.
Claims7
A process for the selective deposition of copper on a substrate, said process comprising the steps:
- (1) contacting the substrate with the vapor of a palladium compound;
- (2) selectively irradiating said palladium compound with light to cause selective deposition of seeds of palladium metal on said substrate;
- and
- (3) depositing copper by electroless deposition on those areas of the substrate which have been seeded with palladium.
1 more element
Dependencies are inferred from the claim text.