C23C 18/1879
Use of metal
Official title: {Use of metal, e.g. activation, sensitisation with noble metals}
C23C18/1879 (Use of metal) appears on 170 US grants and 223 published applications in this corpus.
Search patents in C23C- Granted patents
- 170
- Published applications
- 223
- Assignees
- 153
- Inventors
- 544
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 6 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 8 |
| 2003 | 2 | 13 |
| 2004 | 4 | 12 |
| 2005 | 6 | 14 |
| 2006 | 3 | 10 |
| 2007 | 3 | 10 |
| 2008 | 4 | 11 |
| 2009 | 4 | 12 |
| 2010 | 4 | 6 |
| 2011 | 5 | 6 |
| 2012 | 9 | 13 |
| 2013 | 4 | 6 |
| 2014 | 5 | 16 |
| 2015 | 8 | 11 |
| 2016 | 9 | 19 |
| 2017 | 13 | 11 |
| 2018 | 5 | 8 |
| 2019 | 7 | 13 |
| 2020 | 7 | 8 |
| 2021 | 8 | 3 |
| 2022 | 3 | 4 |
| 2023 | 5 | 4 |
| 2024 | 1 | 0 |
| 2025 | 1 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bendable nickel plating on flexible substrates17 Feb 2026US 12,553,134 B2MacDermid Enthone Inc.
- Structure with conductive pattern and method for manufacturing same29 Jul 2025US 12,376,230 B2Asahi Kasei Kabushiki Kaisha
- Method for manufacturing electroless plating substrate and method for forming metal layer on surface of substrate9 Jan 2024US 11,865,518 B2National Tsing Hua University
- Array substrate, manufacturing method of the array substrate, and display panel28 Nov 2023US 11,830,887 B2Chuzhou Hkc Optoelectronics Technology Co., Ltd.
- Method of manufacturing ceramic electronic component21 Nov 2023US 11,821,090 B2Murata Manufacturing Co., Ltd.
- Substrate liquid processing method and substrate liquid processing apparatus27 Aug 2026US 2026/0255892 A1Tokyo Electron Limited
- Bendable Nickel Plating on Flexible Substrates21 May 2026US 2026/0139380 A1
- Method of metallization with a nickel or cobalt alloy for the manufacture of semiconductor devices1 May 2025US 2025/0137140 A1MacDermid Enthone Inc.
- Bendable Nickel Plating on Flexible Substrates3 Apr 2025US 2025/0109499 A1MacDermid Enthone Inc.
- Asymmetrical electrolytic plating for a conductive pattern26 Oct 2023US 2023/0345642 A1Averatek Corporation
Most cited
By later US patents
- Electroless CU deposition on a barrier layer by CU contact displacement for ULSI applications448US 5,891,513 ACornell Research Foundation, Inc. · 1999
- Ink jet printing of printed circuit boards102US 4,668,533 AE. I. Du Pont de Nemours and Company · 1987
- Selective deposition of copper95US 4,574,095 AInternational Business Machines Corporation · 1986
- Electroless deposition employing laser-patterned masking layer90US 4,865,873 AGeneral Electric Company · 1989
- Manufacture of solar cells74US 4,152,824 AMobil Tyco Solar Energy Corporation · 1979