C23C 18/1886
Multistep pretreatment
Official title: {Multistep pretreatment}
C23C18/1886 (Multistep pretreatment) appears on 331 US grants and 396 published applications in this corpus.
Search patents in C23C- Granted patents
- 331
- Published applications
- 396
- Assignees
- 264
- Inventors
- 1,080
- Latest grant
- 4 Nov 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 3 | 0 |
| 1979 | 3 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 5 | 0 |
| 1984 | 8 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 2 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 3 | 0 |
| 1992 | 6 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 6 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 4 | 0 |
| 1999 | 4 | 0 |
| 2000 | 0 | 0 |
| 2001 | 6 | 2 |
| 2002 | 5 | 4 |
| 2003 | 4 | 11 |
| 2004 | 9 | 16 |
| 2005 | 7 | 25 |
| 2006 | 4 | 27 |
| 2007 | 6 | 16 |
| 2008 | 6 | 14 |
| 2009 | 13 | 17 |
| 2010 | 8 | 21 |
| 2011 | 7 | 15 |
| 2012 | 15 | 4 |
| 2013 | 9 | 13 |
| 2014 | 12 | 15 |
| 2015 | 10 | 28 |
| 2016 | 11 | 29 |
| 2017 | 13 | 26 |
| 2018 | 19 | 14 |
| 2019 | 18 | 28 |
| 2020 | 16 | 21 |
| 2021 | 18 | 11 |
| 2022 | 7 | 10 |
| 2023 | 8 | 13 |
| 2024 | 4 | 9 |
| 2025 | 4 | 6 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Tin oxide multilayer film with catalyst layer and method for forming same4 Nov 2025US 12,458,961 B2Panasonic Intellectual Property Management Co., Ltd.
- Method for selective metallisation of inorganic dielectrics or semiconductors17 Jun 2025US 12,336,114 B2Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Surface conditioner for electroless deposition22 Apr 2025US 12,281,391 B2Nanyang Technological University
- Substrate processing apparatus and substrate processing method15 Apr 2025US 12,276,027 B2Tokyo Electron Limited
- Electroless plating method for metal gate fill1 Oct 2024US 12,107,150 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Electroless copper plating deposit, electroless copper plating bath, and method of producing electroless copper plating deposit6 Aug 2026US 2026/0226629 A1C. Uyemura & Co., Ltd.
- Semiconductor device and method of manufacturing semicondutor device25 Dec 2025US 2025/0391793 A1Fuji Electric Co., Ltd.
- Compound, polymer compound, photosensitive surface treatment agent, laminate, substrate for pattern formation, transistor, pattern formation method, and transistor manufacturing method18 Dec 2025US 2025/0386722 A1Nikon Corporation
- Catalyst for water electrolysis using fluorine-doped tin oxide support and method for manufacturing the same30 Oct 2025US 2025/0333846 A1Korea Basic Science Institute
- Electroless Deposition Process for Semiconductor Devices19 Jun 2025US 2025/0201740 A1Wolfspeed, Inc.
Most cited
By later US patents
- Electroless plating process for the manufacture of printed circuit boards305US 5,648,125 A1997
- Selective metallization process265US 5,510,216 AShipley Company, L.L.C. · 1996
- High resolution patterning on solid substrates236US 5,079,600 A1992
- Deep ultraviolet photolithographically defined ultra-thin films for selective cell adhesion and outgrowth and method of manufacturing the same and devices containing the same119US 5,324,591 AGeo-Centers, Inc. · 1994
- Plated terminations97US 6,960,366 B2AVX Corporation · 2005