US 4,622,069 AGranted

Catalyst composition for forming electroless plating on ceramics

AssigneeOkuno Chemical Industry Co., Ltd.

InventorsYoshito Akai, Nobuyuki Konaga, Yasunori Arisato, Masatoshi Wada, Yukikazu Moritsu

Life of this patent

Estimating the term…

Abstract

A composition for forming electroless plating on ceramics which comprises (i) 1 weight part of at least one member selected from the group consisting of organic palladium compounds and organic silver compounds, (ii) 0.1 to 200 weight parts of at least one member selected from the group consisting of organic metal compounds, (iii) 10 to 1000 weight parts of an organic solvent and optionally (iv) 1 to 500 weight parts of at least one member selected from the group consisting of high molecular compounds and particulate inorganic substances.

Claims12

Dependent claims

A catalyst composition for forming electroless plating on ceramics which comprises:

(i) 1 weight part of at least one member selected from the group consisting of
(a) organic palladium compounds of the general formulas:
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.n' H.sub.2n'+1).sub.2 NH].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.n' H.sub.2n'+1).sub.3 N.sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.n' H.sub.2n'+1)NH(C.sub.6 H.sub.5)].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.6 H.sub.5).sub.2 NH].sub.2 and
(C.sub.n H.sub.2n+1 COO).sub.2 Pd(C.sub.5 H.sub.5 N).sub.2
wherein n and n', respectively are an integer of 1 to 7 and
(b) organic silver compounds of the general formulas:
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.n' H.sub.2n'+1).sub.2 NH],
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.n' H.sub.2n'+1).sub.3 N],
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.n' H.sub.2n'+1)NH(C.sub.6 H.sub.5)],
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.6 H.sub.5).sub.2 NH] and
(C.sub.n H.sub.2n+1 COO)Ag(C.sub.5 H.sub.5 N)
wherein n and n', respectively, are an integer of 1 to 7,
(ii) 0.1 to 200 weight parts of at least one member selected from the group consisting of organic metal compounds of the general formulas:
(C.sub.n H.sub.2n+1 COO).sub.2 M,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.n' H.sub.2n'+1).sub.2 NH].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.n' H.sub.2n'+1).sub.3 N].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.n' H.sub.2n'+1)NH(C.sub.6 H.sub.5)].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.6 H.sub.5).sub.2 NH].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M(C.sub.5 H.sub.5 N).sub.2,
(C.sub.n H.sub.2n+1 COO).sub.3 Al,
(C.sub.n" H.sub.2n"+1 O).sub.3 Al and
C.sub.6 H.sub.9 O.sub.3 Al(OC.sub.n" H.sub.2n"+1).sub.2
wherein n is equal to 0 or an integer of 1 to 18, n' is an integer of 1 to 18, n" is an integer of 2 to 4, and M denotes copper, nickel, iron, aluminum, zinc or tin and
(iii) 10 to 1000 weight parts of an organic solvent.

24 more elements

A catalyst composition for forming electroless plating on ceramics which comprises:

(i) 1 weight part of at least one member selected from the group consisting of
(a) organic palladium compounds of the general formulas:
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.n' H.sub.2n'+1).sub.2 NH].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.n' H.sub.2n'+1).sub.3 N].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.n' H.sub.2n'+1)NH(C.sub.6 H.sub.5)].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 Pd[(C.sub.6 H.sub.5).sub.2 NH].sub.2 and
(C.sub.n H.sub.2n+1 COO).sub.2 Pd(C.sub.5 H.sub.5 N).sub.2
wherein n and n', respectively are an integer of 1 to 7 and
(b) organic silver compounds of the general formulas:
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.n' H.sub.2n'+1).sub.2 NH],
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.n' H.sub.2n'+1).sub.3 N],
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.n' H.sub.2n'+1)NH(C.sub.6 H.sub.5)],
(C.sub.n H.sub.2n+1 COO)Ag[(C.sub.6 H.sub.5).sub.2 NH] and
(C.sub.n H.sub.2n+1 COO)Ag(C.sub.5 H.sub.5 N)
wherein n and n', respectively, are an integer of 1 to 7,
(ii) 0.1 to 200 weight parts of at least one member selected from the group consisting of organic metal compounds of the general formulas:
(C.sub.n H.sub.2n+1 COO).sub.2 M,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.n' H.sub.2n'+1).sub.2 NH].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.n' H.sub.2n'+1).sub.3 N].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.n' H.sub.2n'+1)NH(C.sub.6 H.sub.5)].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M[(C.sub.6 H.sub.5).sub.2 NH].sub.2,
(C.sub.n H.sub.2n+1 COO).sub.2 M(C.sub.5 H.sub.5 N).sub.2,
(C.sub.n H.sub.2n+1 COO).sub.3 Al,
(C.sub.n" H.sub.2n"+1 O).sub.3 Al and
C.sub.6 H.sub.9 O.sub.3 Al(OC.sub.n" H.sub.2n"+1).sub.2
wherein n is equal to 0 or an integer of 1 to 18, n' is an integer of 1 to 18, n" is an integer of 2 to 4, and M denotes copper, nickel, iron, aluminum, zinc or tin,
(iii) 10 to 1000 weight parts of an organic solvent, and
(iv) 1 to 500 weight parts of at least one member of the group consisting of high molecular weight organic compounds and particulate inorganic substances.

25 more elements

Dependencies are inferred from the claim text.

patentgrep

Loading patent…

Abstract