C23C 18/1696
Control of atmosphere
Official title: {Control of atmosphere}
C23C18/1696 (Control of atmosphere) appears on 45 US grants and 60 published applications in this corpus.
Search patents in C23C- Granted patents
- 45
- Published applications
- 60
- Assignees
- 51
- Inventors
- 162
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 0 | 4 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 2 | 3 |
| 2007 | 1 | 1 |
| 2008 | 0 | 6 |
| 2009 | 2 | 0 |
| 2010 | 0 | 3 |
| 2011 | 0 | 3 |
| 2012 | 3 | 3 |
| 2013 | 1 | 2 |
| 2014 | 2 | 3 |
| 2015 | 4 | 2 |
| 2016 | 3 | 8 |
| 2017 | 5 | 2 |
| 2018 | 4 | 3 |
| 2019 | 1 | 1 |
| 2020 | 1 | 2 |
| 2021 | 2 | 1 |
| 2022 | 0 | 2 |
| 2023 | 1 | 1 |
| 2024 | 3 | 4 |
| 2025 | 1 | 1 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Advanced barrier nickel oxide (BNiO) coating development for process chamber components via ozone treatment13 Jan 2026US 12,522,923 B2APPLIED Materials.Inc.
- Method for preparing silicon-carbon composite anode material and use thereof26 Aug 2025US 12,401,026 B2Guangdong Brunp Recycling Technology Co., Ltd.
- Laminate and method for producing same15 Oct 2024US 12,116,671 B2Resonac Corporation
- Laminate9 Jul 2024US 12,031,213 B2Resonac Corporation
- Zincating and doping of metal liner for liner passivation and adhesion improvement14 May 2024US 11,984,354 B2Lam Research Corporation
- Ceramic plate, package, manufacturing method for ceramic plate, module, and electric or electronic product6 Aug 2026US 2026/0225963 A1Denka Company Limited
- Nickel plated steel sheet for battery case having excellent surface corrosion resistance and method for manufacturing28 May 2026US 2026/0149092 A1TCC Steel Corp.
- Electroless ni-p plating film for sliding member and manufacturing method therefor30 Jan 2025US 2025/0034717 A1Sanden Corporation
- Electroless plating methods5 Dec 2024US 2024/0404879 A1Semiconductor Components Industries, LLC
- Method for preparing silicon-carbon composite anode material and use thereof7 Nov 2024US 2024/0372083 A1Guangdong Brunp Recycling Technology Co., Ltd.
Most cited
By later US patents
- Chip interconnect and packaging deposition methods and structures556US 7,147,766 B2ASM Nutool, Inc. · 2006
- Chip interconnect and packaging deposition methods and structures105US 6,355,153 B1Nutool, Inc. · 2002
- Electroless deposition method over sub-micron apertures24US 6,824,666 B2APPLIED Materials.Inc. · 2004
- Fabrication of semiconductor interconnect structure19US 7,531,463 B2Novellus Systems, Inc. · 2009
- Method for forming a seed layer for the deposition of a metal on a substrate16US 9,093,381 B2Centre National De La Recherche Scientifique · 2015