Laminate and method for producing same
AssigneeResonac Corporation
InventorsAkira Furuya, Tadaaki Kojima, Hiroshi Suzuki
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Abstract
A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.
Claims14
A laminate comprising a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer,
- wherein pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater, and
- wherein the nickel-containing plating film layer comprises a nickel-phosphorus alloy plating layer (1) having a phosphorus concentration of 8% by mass or higher and lower than 10% by mass, and a nickel-phosphorus alloy plating layer (2) having a phosphorus concentration of 10% by mass or higher and 12% by mass or lower in this order from the metallic base material.
A laminate comprising a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer,
- wherein pinholes in the gold plating film layer are sealed with a fluorinated passive film having a thickness of 8 nm or greater, and
- wherein the gold plating film layer comprises a displacement gold plating film layer and a reduction gold plating film layer in this order from the nickel-containing plating film layer.
Dependencies are inferred from the claim text.