Laminate
AssigneeResonac Corporation
InventorsAkira Furuya, Tadaaki Kojima, Hiroshi Suzuki, Fumiaki Naka
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Abstract
A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.
Claims6
A laminate comprising a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer,
- wherein pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater,
- wherein the passive film is formed on a surface of the nickel-containing plating layer by forcible oxidation of the nickel-containing plating layer.
Dependencies are inferred from the claim text.