Electroless plating methods
AssigneeSemiconductor Components Industries, LLC
InventorsTakashi NOMA, Shinzo ISHIBE
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Abstract
Implementations of a method of electroless deposition may include providing a semiconductor substrate including a first largest planar surface and a second largest planar surface; forming a backmetal layer on the second largest planar surface; attaching a tape over the backmetal layer; and electroless depositing a metal layer on a pad included on the first largest planar surface. The method may include, after electroless depositing, removing the tape; and after removing the tape, baking the semiconductor substrate.
Claims20
A method of electroless deposition comprising:
- providing a semiconductor substrate comprising a first largest planar surface and a second largest planar surface;
- forming a backmetal layer on the second largest planar surface;
- attaching a tape over the backmetal layer;
- electroless depositing a metal layer on a pad comprised on the first largest planar surface;
- after electroless depositing, removing the tape;
- and
- after removing the tape, baking the semiconductor substrate.
A method of electroless deposition comprising:
- providing a semiconductor substrate;
- electroless depositing a metal layer on a pad comprised on a largest planar surface of the semiconductor substrate;
- and
- after electroless depositing, baking the semiconductor substrate.
A method of electroless deposition comprising:
- providing a semiconductor substrate comprising a first largest planar surface and a second largest planar surface;
- coupling a carrier to the first largest planar surface;
- thinning the semiconductor substrate from the second largest planar surface to form an edge ring;
- forming a backmetal layer on the second largest planar surface;
- demounting the carrier from the first largest planar surface;
- electroless depositing a metal layer on a pad comprised on the first largest planar surface and on the backmetal layer;
- and
- baking the semiconductor substrate.
Dependencies are inferred from the claim text.