C23C 16/047
Using irradiation by energy or particles
Official title: {using irradiation by energy or particles}
C23C16/047 (Using irradiation by energy or particles) appears on 280 US grants and 253 published applications in this corpus.
Search patents in C23C- Granted patents
- 280
- Published applications
- 253
- Assignees
- 147
- Inventors
- 617
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 5 | 0 |
| 1992 | 10 | 0 |
| 1993 | 5 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 2 | 0 |
| 1997 | 5 | 0 |
| 1998 | 7 | 0 |
| 1999 | 4 | 0 |
| 2000 | 7 | 0 |
| 2001 | 3 | 3 |
| 2002 | 4 | 14 |
| 2003 | 6 | 7 |
| 2004 | 5 | 13 |
| 2005 | 10 | 15 |
| 2006 | 7 | 13 |
| 2007 | 9 | 8 |
| 2008 | 6 | 4 |
| 2009 | 4 | 11 |
| 2010 | 5 | 9 |
| 2011 | 7 | 7 |
| 2012 | 15 | 13 |
| 2013 | 9 | 6 |
| 2014 | 8 | 4 |
| 2015 | 8 | 10 |
| 2016 | 6 | 9 |
| 2017 | 9 | 10 |
| 2018 | 7 | 10 |
| 2019 | 7 | 10 |
| 2020 | 10 | 9 |
| 2021 | 8 | 15 |
| 2022 | 7 | 16 |
| 2023 | 8 | 13 |
| 2024 | 10 | 11 |
| 2025 | 10 | 8 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Electronic device including s-shaped staggered contacts8 Sep 2026US 12,729,429 B2APPLIED Materials.Inc.
- Method and materials for creating patterns of carbon and/or other elements on substrates or within liquid or frozen media by directed energy deposition of carbon and other elements21 Apr 2026US 12,606,902 B2
- Selective deposition using differential surface charging14 Apr 2026US 12,603,249 B2Tokyo Electron Limited
- Selective deposition on metals using porous low-k materials24 Mar 2026US 12,588,261 B2International Business Machines Corporation
- Fabricating equipment for semiconductor device and method for fabricating semiconductor device17 Feb 2026US 12,557,261 B2Samsung Electronics Co., Ltd.
- Film formation method and film formation apparatus1 Oct 2026US 2026/0297728 A1Tokyo Electron Limited
- Fabricating equipment for semiconductor device and method for fabricating semiconductor device4 Jun 2026US 2026/0156798 A1Samsung Electronics Co., Ltd.
- Laser-assisted epitaxy and etching for manufacturing integrated circuits4 Jun 2026US 2026/0157125 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Area selective atomic layer thin film deposition method16 Apr 2026US 2026/0103794 A1Inha University Research and Business Foundation
- Repair process for clear defects on euv psm masks5 Feb 2026US 2026/0036897 A1
Most cited
By later US patents
- Method for forming a patterned layer by selective chemical vapor deposition351US 5,393,577 ANEC Corporation · 1995
- Image-based three-axis positioner for laser direct write microchemical reaction165US 6,033,721 ARevise, Inc. · 2000
- Fastening devices140US 5,332,348 A1994
- Thermal flux processing by scanning133US 6,987,240 B2APPLIED Materials.Inc. · 2006
- Device enclosures and devices with integrated battery119US 6,986,965 B2Cymbet Corporation · 2006