C23C 14/548
Controlling the composition
Official title: {Controlling the composition}
C23C14/548 (Controlling the composition) appears on 232 US grants and 290 published applications in this corpus.
Search patents in C23C- Granted patents
- 232
- Published applications
- 290
- Assignees
- 188
- Inventors
- 760
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 4 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 3 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 0 |
| 2002 | 4 | 2 |
| 2003 | 4 | 6 |
| 2004 | 4 | 14 |
| 2005 | 5 | 13 |
| 2006 | 5 | 3 |
| 2007 | 5 | 6 |
| 2008 | 4 | 6 |
| 2009 | 2 | 13 |
| 2010 | 3 | 12 |
| 2011 | 5 | 14 |
| 2012 | 9 | 17 |
| 2013 | 8 | 15 |
| 2014 | 10 | 12 |
| 2015 | 12 | 12 |
| 2016 | 11 | 12 |
| 2017 | 13 | 13 |
| 2018 | 11 | 16 |
| 2019 | 8 | 17 |
| 2020 | 16 | 13 |
| 2021 | 9 | 14 |
| 2022 | 10 | 13 |
| 2023 | 6 | 15 |
| 2024 | 14 | 15 |
| 2025 | 13 | 9 |
| 2026 | 6 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Film forming method and film forming apparatus8 Sep 2026US 12,729,426 B2Tokyo Electron Limited
- Strain resistance film, physical quantity sensor, and method for manufacturing the strain resistance film18 Aug 2026US 12,709,787 B2TDK Corporation
- In situ and tunable deposition of a film16 Jun 2026US 12,655,515 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for controlling film thickness, and film deposition system and method using same7 Apr 2026US 12,595,553 B2Angstrom Engineering Inc.
- Method for forming an LiCoO2 film and device for carrying out same17 Feb 2026US 12,553,122 B2
- In situ and tunable deposition of a film1 Oct 2026US 2026/0297727 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated junction silicide and selective metal capping with pullback24 Sep 2026US 2026/0293633 A1
- Sputtering with good compositional uniformity17 Sep 2026US 2026/0275492 A1APPLIED Materials.Inc.
- Deep black decorative coating with increased thermal stability23 Jul 2026US 2026/0209931 A1Oerlikon Surface Solutions AG, PfäFfikon
- System and Method For a Spatially-resolved Thin Film Linear Deposition28 May 2026US 2026/0146313 A1
Most cited
By later US patents
- Nozzle-based, vapor-phase, plume delivery structure for use in production of thin-film deposition layer171US 7,194,197 B1Global Solar Energy, Inc. · 2007
- Ellipsometric control of material growth168US 5,091,320 ABell Communications Research, Inc. · 1992
- Electrochromic devices147US 8,300,298 B2Soladigm, Inc. · 2012
- Lanthanide doped TiOx dielectric films by plasma oxidation106US 7,026,694 B2Micron Technology, Inc. · 2006
- Lanthanide doped TiOx dielectric films102US 6,790,791 B2Micron Technology, Inc. · 2004