System and method for controlling film thickness, and film deposition system and method using same

A vapour deposition system for spatially controlling a deposited film thickness on a substrate, the vapour deposition system comprising:

• an emission source to emit a deposition flux along a deposition flux axis;
• a substrate holder configurable to position the substrate at a designated angle relative to said deposition flux axis;
• and
• a translatable shutter comprising a flux barrier disposed between said emission source and the substrate and operable to translate said flux barrier through said deposition flux according to a designated linear translation designated to spatially control the deposited film thickness, wherein said flux barrier comprises an active flux-blocking region having a curved leading edge, wherein said translatable shutter further comprises an actuator operable to translate said flux barrier according to said designated linear translation at a non-uniform linear velocity;
• wherein a curvature of said curved leading edge and said non-uniform linear velocity are designated as a function of said designated angle to enhance a uniformity of the deposited film thickness;
• and
• wherein said active flux-blocking region further comprises a curved tailing edge to act as an opposed leading edge to operate said flux barrier as a bi-directional shutter;
• wherein said actuator translates said flux barrier via an unobstructive actuation arm coupled to said active flux-blocking region so not to interfere with either of said leading edge or said tailing edge.