C09K 3/1463
Aqueous liquid suspensions
Official title: {Aqueous liquid suspensions}
C09K3/1463 (Aqueous liquid suspensions) appears on 1,337 US grants and 1,813 published applications in this corpus.
Search patents in C09K- Granted patents
- 1,337
- Published applications
- 1,813
- Assignees
- 412
- Inventors
- 2,591
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 6 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 4 | 0 |
| 1996 | 4 | 0 |
| 1997 | 12 | 0 |
| 1998 | 16 | 0 |
| 1999 | 27 | 0 |
| 2000 | 33 | 0 |
| 2001 | 57 | 23 |
| 2002 | 65 | 60 |
| 2003 | 64 | 69 |
| 2004 | 48 | 98 |
| 2005 | 38 | 107 |
| 2006 | 57 | 93 |
| 2007 | 45 | 107 |
| 2008 | 46 | 103 |
| 2009 | 39 | 90 |
| 2010 | 38 | 84 |
| 2011 | 52 | 60 |
| 2012 | 50 | 64 |
| 2013 | 58 | 69 |
| 2014 | 68 | 49 |
| 2015 | 47 | 94 |
| 2016 | 59 | 65 |
| 2017 | 50 | 65 |
| 2018 | 50 | 46 |
| 2019 | 48 | 55 |
| 2020 | 41 | 58 |
| 2021 | 41 | 57 |
| 2022 | 41 | 48 |
| 2023 | 29 | 54 |
| 2024 | 23 | 54 |
| 2025 | 32 | 77 |
| 2026 | 22 | 64 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Polishing composition for semiconductor process and method for polishing a substrate using the same22 Sep 2026US 12,742,096 B2Ycchem Co., Ltd.
- Compositions for polishing hardmasks and related systems and methods22 Sep 2026US 12,742,097 B2Entegris, Inc.
- Chemical mechanical polishing composition and polishing method22 Sep 2026US 12,742,098 B2Jsr Corporation
- Cerium based particles, process for producing the same and uses thereof in polishing18 Aug 2026US 12,709,549 B2Rhodia Operations
- Polishing composition1 Oct 2026US 2026/0297404 A1
- Polishing composition1 Oct 2026US 2026/0297405 A1
- Chemical-mechanical polishing composition containing silica and ceria abrasives1 Oct 2026US 2026/0297406 A1Entegris, Inc.
- Polishing method, abrasive, and semiconductor device24 Sep 2026US 2026/0286181 A1Kioxia Corporation
- Polishing compositions and methods of use thereof24 Sep 2026US 2026/0286184 A1Fujifilm Electronic Materials U.S.A., Inc.
Most cited
By later US patents
- Chemical mechanical polishing slurry for metal layers541US 5,527,423 ACabot Corporation · 1996
- Slurries for chemical mechanical polishing268US 5,340,370 AIntel Corporation · 1994
- Chemical mechanical polishing slurry useful for copper/tantalum substrate192US 6,063,306 ACabot Corporation · 2000
- Chemical mechanical polishing (CMP) slurry for copper and method of use in integrated circuit manufacture190US 5,897,375 AMotorola, Inc. · 1999
- Compositions and structures for chemical mechanical polishing of FeRAM capacitors and method of fabricating FeRAM capacitors using same175US 6,346,741 B1Advanced Technology Materials, Inc. · 2002