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US 2026/0297405 A1Published application
Polishing composition
OwnerSonosuke ISHIGURO, Atsushi TSUZUKI +1inventors
InventorsSonosuke ISHIGURO, Atsushi TSUZUKI, Shota SUZUKI
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Abstract
An object of the present invention is to provide a novel polishing composition enabling a carbon film to be polished at a high polishing removal rate. A polishing composition containing a cation-modified abrasive having an average secondary particle diameter of 80 nm or more, a water-soluble polymer having a swelling ratio of 6.80% or less, and a liquid carrier.
Claims9
A polishing composition comprising:
- a cation-modified abrasive having an average secondary particle diameter of 80 nm or more;
- a water-soluble polymer having a swelling ratio of 6.80% or less;
- and
- a liquid carrier.
1 more element
Dependencies are inferred from the claim text.