Polishing method, abrasive, and semiconductor device
AssigneeKioxia Corporation
InventorsMomoka OTANI, Shuntaro YAMASHITA, Akifumi GAWASE
Life of this patent
Estimating the term…
Abstract
A polishing method includes: supplying an abrasive to a semiconductor substrate provided with a polishing object with a mixture of a first substance and a second substance having chemical composition different from chemical composition of the first substance; and polishing the polishing object using the abrasive, wherein the abrasive contains: a partial dissolution solution having potential and pH that dissolve the first substance and do not dissolve the second substance; and abrasive grains dispersed in the partial dissolution solution.
Claims19
A polishing method comprising:
- supplying an abrasive to a semiconductor substrate provided with a polishing object with a mixture of a first substance and a second substance having chemical composition different from chemical composition of the first substance;
- and
- polishing the polishing object using the abrasive, wherein
- the abrasive comprises:
- a partial dissolution solution having redox potential and pH that dissolve the first substance and do not dissolve the second substance;
- and
- abrasive grains dispersed in the partial dissolution solution.
An abrasive comprising:
- a partial dissolution solution having redox potential and pH that dissolve a first substance and do not dissolve a second substance having chemical composition different from chemical composition of the first substance;
- and
- abrasive grains dispersed in the partial dissolution solution, wherein
- the abrasive is used in the polishing of a polishing object with a mixture of the first substance and the second substance.
A semiconductor device comprising:
- a protective layer disposed on a semiconductor substrate;
- and
- a polishing object with a mixture of a first substance and a second substance having chemical composition different from chemical composition of the first substance, the polishing object being filled into an open depression in a surface of the protective layer, wherein
- a ratio of a concentration of the first substance to a concentration of the second substance at a first position contained in the polishing object is higher than the ratio at a second position closer to an opening of the depression than the first position.
Dependencies are inferred from the claim text.