C09G 1/02
Containing abrasives or grinding agents
Official title: containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)}
C09G1/02 (Containing abrasives or grinding agents) appears on 2,305 US grants and 3,276 published applications in this corpus.
Search patents in C09G- Granted patents
- 2,305
- Published applications
- 3,276
- Assignees
- 566
- Inventors
- 3,790
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 4 | 0 |
| 1986 | 5 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 3 | 0 |
| 1990 | 4 | 0 |
| 1991 | 2 | 0 |
| 1992 | 9 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 5 | 0 |
| 1997 | 9 | 0 |
| 1998 | 18 | 0 |
| 1999 | 36 | 0 |
| 2000 | 49 | 0 |
| 2001 | 69 | 41 |
| 2002 | 104 | 127 |
| 2003 | 114 | 145 |
| 2004 | 87 | 170 |
| 2005 | 77 | 175 |
| 2006 | 94 | 171 |
| 2007 | 85 | 169 |
| 2008 | 76 | 155 |
| 2009 | 55 | 150 |
| 2010 | 69 | 114 |
| 2011 | 71 | 94 |
| 2012 | 72 | 90 |
| 2013 | 83 | 95 |
| 2014 | 88 | 87 |
| 2015 | 77 | 131 |
| 2016 | 87 | 102 |
| 2017 | 85 | 114 |
| 2018 | 84 | 98 |
| 2019 | 88 | 133 |
| 2020 | 97 | 164 |
| 2021 | 93 | 141 |
| 2022 | 83 | 133 |
| 2023 | 72 | 125 |
| 2024 | 63 | 116 |
| 2025 | 91 | 128 |
| 2026 | 65 | 108 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Functionalized carbon particle CMP slurry dispersion6 Oct 2026US 12,753,326 B2DuPont Electronic Materials Holding, Inc.
- Methods of forming an abrasive slurry and methods for chemical-mechanical polishing29 Sep 2026US 12,746,637 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Chemical mechanical planarization polishing for shallow trench isolation29 Sep 2026US 12,751,256 B2Versum Materials US, LLC
- Polishing composition for semiconductor process and method for polishing a substrate using the same22 Sep 2026US 12,742,096 B2Ycchem Co., Ltd.
- Compositions for polishing hardmasks and related systems and methods22 Sep 2026US 12,742,097 B2Entegris, Inc.
- Vinyl-based polymer, method for producing same, polishing liquid, and vinyl-based monomer8 Oct 2026US 2026/0308299 A1Toagosei Co., Ltd.
- Cmp slurry composition for polishing copper barrier layer8 Oct 2026US 2026/0308417 A1Ycchem Co., Ltd.
- Modified cerium oxide polishing solution for shallow trench isolation and preparation method thereof1 Oct 2026US 2026/0297378 A1Inner Mongolia University
- Cmp polishing liquid and polishing method1 Oct 2026US 2026/0297379 A1Resonac Corporation
- Cmp polishing liquid and polishing method1 Oct 2026US 2026/0297380 A1Resonac Corporation
Most cited
By later US patents
- Chemical mechanical polishing slurry for metal layers541US 5,527,423 ACabot Corporation · 1996
- Chemical mechanical polishing slurry useful for copper substrates281US 5,954,997 ACabot Corporation · 1999
- Slurries for chemical mechanical polishing268US 5,340,370 AIntel Corporation · 1994
- Chemical mechanical polishing (CMP) slurry for polishing copper interconnects which use tantalum-based barrier layers232US 6,001,730 AMotorola, Inc. · 1999
- Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor218US 4,954,142 AInternational Business Machines Corporation · 1990