C04B 2237/12
Metallic interlayers
C04B2237/12 (Metallic interlayers) appears on 1,191 US grants and 920 published applications in this corpus.
Search patents in C04B- Granted patents
- 1,191
- Published applications
- 920
- Assignees
- 485
- Inventors
- 2,341
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 14 | 0 |
| 1977 | 5 | 0 |
| 1978 | 8 | 0 |
| 1979 | 3 | 0 |
| 1980 | 6 | 0 |
| 1981 | 14 | 0 |
| 1982 | 8 | 0 |
| 1983 | 8 | 0 |
| 1984 | 10 | 0 |
| 1985 | 14 | 0 |
| 1986 | 19 | 0 |
| 1987 | 30 | 0 |
| 1988 | 28 | 0 |
| 1989 | 33 | 0 |
| 1990 | 26 | 0 |
| 1991 | 39 | 0 |
| 1992 | 38 | 0 |
| 1993 | 27 | 0 |
| 1994 | 20 | 0 |
| 1995 | 19 | 0 |
| 1996 | 22 | 0 |
| 1997 | 11 | 0 |
| 1998 | 13 | 0 |
| 1999 | 29 | 0 |
| 2000 | 26 | 0 |
| 2001 | 28 | 10 |
| 2002 | 33 | 37 |
| 2003 | 34 | 32 |
| 2004 | 20 | 37 |
| 2005 | 27 | 26 |
| 2006 | 19 | 23 |
| 2007 | 13 | 18 |
| 2008 | 14 | 20 |
| 2009 | 9 | 24 |
| 2010 | 18 | 41 |
| 2011 | 13 | 26 |
| 2012 | 24 | 58 |
| 2013 | 29 | 35 |
| 2014 | 30 | 49 |
| 2015 | 35 | 55 |
| 2016 | 30 | 62 |
| 2017 | 46 | 51 |
| 2018 | 45 | 42 |
| 2019 | 48 | 35 |
| 2020 | 35 | 34 |
| 2021 | 30 | 40 |
| 2022 | 24 | 50 |
| 2023 | 23 | 43 |
| 2024 | 45 | 32 |
| 2025 | 31 | 27 |
| 2026 | 18 | 13 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C04B 2237/125Based on noble metalsIndexing code533
- C04B 2237/126Wherein the active component for bonding is not the largest fraction ofIndexing code454
- C04B 2237/122Based on refractory metalsIndexing code413
- C04B 2237/123Based on iron group metalsIndexing code369
- C04B 2237/124Based on copperIndexing code365
- C04B 2237/121Based on aluminiumIndexing code276
Recent patents
- Metal-ceramic substrate, method for the production thereof, and module28 Jul 2026US 12,692,202 B2Heraeus Electronics GmbH & Co. KG
- High temperature brazing of metals and ceramics to carbon substrates14 Jul 2026US 12,679,776 B2Honeywell International Inc.
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,268 B2Mitsubishi Materials Corporation
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Method for producing a pressure sensor6 Aug 2026US 2026/0227258 A1Endress + Hauser GmbH + Co. KG
Most cited
By later US patents
- Compact of boron-doped diamond and method for making same385US 4,268,276 AGeneral Electric Company · 1981
- Electrostatic chuck having gas cavity and method244US 6,310,755 B1APPLIED Materials.Inc. · 2001
- Functionally stepped, resistive ceramic163US 5,880,439 APhilip Morris Incorporated · 1999
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Thermally stable diamond abrasive compact body157US 4,940,180 A1990