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AssigneeHeraeus Electronics GmbH & Co. KG
InventorsAndre Schwöbel, Daniel Schnee, Leszek Niewolak, Miriam Rauer, Ruzica Denadic
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A metal-ceramic substrate which has a highly stable bond between the metal layer and the ceramic body, and also high thermal conductivity and electrical conductivity. The metal-ceramic substrate comprises (a) a ceramic body, (b) a metal layer, and (c) a bonding layer located between the ceramic body and the metal layer. The bonding layer comprises (i) a metal M1 having a melting point of at least 700° C., (ii) a metal M2 having a melting point of less than 700° C., (iii) a metal M3 selected from the group of active metals, and (iv) a metal M4 selected from the group consisting of bismuth, gallium, zinc, indium, germanium, aluminum and magnesium. The bonding layer has the following characteristics: (c1) M(M2)EDX=10-20 weight percent, (c2) 15 weight percent≤[M(M4)/M(M2)]ICP*1000 weight percent+M(M2)EDX≤100 weight percent and (c3) M(Ag)EDX<10 weight percent.
A metal-ceramic substrate comprising:
Dependencies are inferred from the claim text.