C04B 2237/125
Based on noble metals
Official title: based on noble metals, e.g. silver
C04B2237/125 (Based on noble metals) appears on 533 US grants and 379 published applications in this corpus.
Search patents in C04B- Granted patents
- 533
- Published applications
- 379
- Assignees
- 254
- Inventors
- 1,102
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 2 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 1 | 0 |
| 1984 | 3 | 0 |
| 1985 | 4 | 0 |
| 1986 | 12 | 0 |
| 1987 | 15 | 0 |
| 1988 | 12 | 0 |
| 1989 | 14 | 0 |
| 1990 | 15 | 0 |
| 1991 | 23 | 0 |
| 1992 | 18 | 0 |
| 1993 | 11 | 0 |
| 1994 | 11 | 0 |
| 1995 | 9 | 0 |
| 1996 | 17 | 0 |
| 1997 | 3 | 0 |
| 1998 | 10 | 0 |
| 1999 | 11 | 0 |
| 2000 | 13 | 0 |
| 2001 | 12 | 6 |
| 2002 | 15 | 16 |
| 2003 | 20 | 21 |
| 2004 | 9 | 17 |
| 2005 | 14 | 8 |
| 2006 | 4 | 8 |
| 2007 | 8 | 7 |
| 2008 | 5 | 15 |
| 2009 | 4 | 12 |
| 2010 | 9 | 20 |
| 2011 | 5 | 4 |
| 2012 | 9 | 17 |
| 2013 | 8 | 8 |
| 2014 | 11 | 17 |
| 2015 | 14 | 16 |
| 2016 | 12 | 25 |
| 2017 | 21 | 17 |
| 2018 | 12 | 15 |
| 2019 | 15 | 17 |
| 2020 | 18 | 12 |
| 2021 | 11 | 20 |
| 2022 | 14 | 25 |
| 2023 | 8 | 19 |
| 2024 | 26 | 19 |
| 2025 | 15 | 11 |
| 2026 | 11 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High temperature brazing of metals and ceramics to carbon substrates14 Jul 2026US 12,679,776 B2Honeywell International Inc.
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,268 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,269 B2Mitsubishi Materials Corporation
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Method for producing a pressure sensor6 Aug 2026US 2026/0227258 A1Endress + Hauser GmbH + Co. KG
- Silicon nitride sintered body, silicon nitride substrate, silicon nitride circuit board, and semiconductor device16 Jul 2026US 2026/0200804 A1Niterra Materials Co., Ltd.
- Metal-ceramic substrate with contact area29 Jan 2026US 2026/0033336 A1Heraeus Electronics GmbH & Co. KG
Most cited
By later US patents
- Functionally stepped, resistive ceramic163US 5,880,439 APhilip Morris Incorporated · 1999
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Composite materials156US 4,055,451 A1977
- Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication143US 4,899,922 AGeneral Electric Company · 1990
- Living hard tissue replacement, its preparation127US 5,125,971 ATDK Corporation · 1992