Copper/ceramic bonded body and insulating circuit substrate
AssigneeMitsubishi Materials Corporation
InventorNobuyuki Terasaki
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Abstract
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where in an edge region E of each of the copper members, an area ratio of each of Ag solid solution parts having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
Claims6
A copper/ceramic bonded body obtained by bonding a copper member consisting of copper or a copper alloy to a ceramic member,
- wherein in an edge region of the copper member, an area ratio of an Ag solid solution part having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
An insulating circuit substrate obtained by bonding a copper sheet consisting of copper or a copper alloy to a surface of a ceramic substrate,
- wherein in an edge region of the copper sheet, an area ratio of an Ag solid solution part having an Ag concentration of 0.5% by mass or more and 15% by mass or less is set in a range of 0.03 or more and 0.35 or less.
Dependencies are inferred from the claim text.