Copper/ceramic bonded body and insulating circuit substrate
AssigneeMitsubishi Materials Corporation
InventorNobuyuki Terasaki
Life of this patent
Estimating the term…
Abstract
The copper/ceramic bonded body according to the present invention is a copper/ceramic bonded body obtained by bonding copper members consisting of copper or a copper alloy to a ceramic member, where at a bonded interface between the ceramic member and each of the copper members, the distance between the ceramic member and each of the copper members in an end portion of each of the copper members is in a range of 3 μm or more and 30 μm or less, and a void ratio in an end portion region (E) of each of the copper members is 10% or less.
Claims17
A copper/ceramic bonded body obtained by bonding a copper member consisting of copper or a copper alloy to a ceramic member,
- wherein the copper member has a chamfered surface on a peripheral edge of a surface that faces the ceramic member to form a crevice between the copper member and the ceramic member,
- a height h of the crevice from a surface of the ceramic member to an outermost edge of the copper member in a lamination direction is in a range of 3 μm or more and 30 μm or less, and
- a void ratio in an end portion region of the copper member is 10% or less, the end portion region being a rectangular area enclosed by 30 μm in height and 400 μm in width at a bottom peripheral part of the copper member in a cross section in the lamination direction, a vertical side of the rectangular area closer to the peripheral edge is collinear with a virtual vertical line drawn from an intersection P to the surface of the ceramic member, the intersection P being an intersection of a side of the copper member and a line parallel to the surface of the ceramic member at a location ⅓ of a thickness of the copper member from the surface of the ceramic member.
An insulating circuit substrate obtained by bonding a copper sheet consisting of copper or a copper alloy to a surface of a ceramic substrate,
- wherein the copper sheet has a chamfered surface on a peripheral edge of a surface that faces the ceramic substrate to form a crevice between the copper sheet and the ceramic substrate,
- at a bonded interface between the ceramic substrate and the copper sheet, a height h of the crevice from a surface of the ceramic substrate to an outermost edge of the copper sheet in a lamination direction is set to be in a range of 3 μm or more and 30 μm or less, and
- a void ratio in an end portion region of the copper sheet is 10% or less, the end portion region being a rectangular area enclosed by 30 μm in height and 400 μm in width at a bottom peripheral part of the copper sheet in a cross section in the lamination direction, a vertical side of the rectangular area closer to the peripheral edge is collinear with a virtual vertical line drawn from an intersection P to the surface of the ceramic substrate, the intersection P being an intersection of a side of the copper sheet and a line parallel to the surface of the ceramic substrate at a location ⅓ of a thickness of the copper sheet from the surface of the ceramic substrate.
Dependencies are inferred from the claim text.