C04B 2237/126
Wherein the active component for bonding is not the largest fraction of
Official title: wherein the active component for bonding is not the largest fraction of the interlayer
C04B2237/126 (Wherein the active component for bonding is not the largest fraction of) appears on 454 US grants and 323 published applications in this corpus.
Search patents in C04B- Granted patents
- 454
- Published applications
- 323
- Assignees
- 184
- Inventors
- 825
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 4 | 0 |
| 1979 | 0 | 0 |
| 1980 | 3 | 0 |
| 1981 | 4 | 0 |
| 1982 | 3 | 0 |
| 1983 | 5 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 13 | 0 |
| 1987 | 11 | 0 |
| 1988 | 6 | 0 |
| 1989 | 14 | 0 |
| 1990 | 9 | 0 |
| 1991 | 22 | 0 |
| 1992 | 11 | 0 |
| 1993 | 12 | 0 |
| 1994 | 7 | 0 |
| 1995 | 8 | 0 |
| 1996 | 9 | 0 |
| 1997 | 5 | 0 |
| 1998 | 11 | 0 |
| 1999 | 12 | 0 |
| 2000 | 17 | 0 |
| 2001 | 9 | 2 |
| 2002 | 7 | 6 |
| 2003 | 6 | 7 |
| 2004 | 3 | 12 |
| 2005 | 5 | 2 |
| 2006 | 2 | 0 |
| 2007 | 3 | 2 |
| 2008 | 2 | 5 |
| 2009 | 2 | 2 |
| 2010 | 2 | 8 |
| 2011 | 2 | 4 |
| 2012 | 4 | 13 |
| 2013 | 7 | 17 |
| 2014 | 9 | 19 |
| 2015 | 16 | 25 |
| 2016 | 13 | 25 |
| 2017 | 21 | 21 |
| 2018 | 17 | 18 |
| 2019 | 26 | 12 |
| 2020 | 16 | 19 |
| 2021 | 14 | 18 |
| 2022 | 12 | 25 |
| 2023 | 11 | 24 |
| 2024 | 24 | 13 |
| 2025 | 15 | 16 |
| 2026 | 8 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,268 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,269 B2Mitsubishi Materials Corporation
- Insulating substrate and manufacturing method thereof21 Apr 2026US 12,610,816 B2Dowa Metaltech Co., Ltd.
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Method for producing a pressure sensor6 Aug 2026US 2026/0227258 A1Endress + Hauser GmbH + Co. KG
Most cited
By later US patents
- Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication143US 4,899,922 AGeneral Electric Company · 1990
- Microwave technique for brazing materials111US 6,054,693 ACalifornia Institute of Technology · 2000
- Composite compact components fabricated with high temperature brazing filler metal and method for making same110US 4,225,322 AGeneral Electric Company · 1980
- Thermally stable diamond compacts106US 4,670,025 A1987
- Brazing of diamond film to tungsten carbide105US 5,738,698 ASaint-Gobain/Norton Industrial Ceramics Corporation · 1998