C04B 2237/128
The active component for bonding being silicon
C04B2237/128 (The active component for bonding being silicon) appears on 100 US grants and 104 published applications in this corpus.
Search patents in C04B- Granted patents
- 100
- Published applications
- 104
- Assignees
- 48
- Inventors
- 174
- Latest grant
- 10 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 0 |
| 2003 | 0 | 3 |
| 2004 | 1 | 2 |
| 2005 | 0 | 1 |
| 2006 | 2 | 0 |
| 2007 | 1 | 2 |
| 2008 | 1 | 1 |
| 2009 | 2 | 0 |
| 2010 | 0 | 4 |
| 2011 | 0 | 4 |
| 2012 | 1 | 4 |
| 2013 | 5 | 6 |
| 2014 | 2 | 9 |
| 2015 | 7 | 10 |
| 2016 | 5 | 9 |
| 2017 | 11 | 8 |
| 2018 | 7 | 11 |
| 2019 | 12 | 3 |
| 2020 | 6 | 9 |
| 2021 | 5 | 4 |
| 2022 | 1 | 3 |
| 2023 | 4 | 5 |
| 2024 | 4 | 0 |
| 2025 | 3 | 3 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods of preparing metal sheets for a DCB / DAB substrate bonding process10 Feb 2026US 12,545,011 B2Littelfuse, Inc.
- Method for manufacturing bonded body and method for manufacturing insulation circuit substrate8 Jul 2025US 12,356,554 B2Mitsubishi Materials Corporation
- Electric circuit board and power module1 Jul 2025US 12,349,299 B2KYOCERA Corporation
- Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate14 Jan 2025US 12,199,006 B2Mitsubishi Materials Corporation
- Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same29 Oct 2024US 12,128,494 B2Watlow Electric Manufacturing Company
- Bonded body13 Aug 2026US 2026/0234066 A1NGK Corporation
- Silicon nitride sintered body, silicon nitride substrate, silicon nitride circuit board, and semiconductor device16 Jul 2026US 2026/0200804 A1Niterra Materials Co., Ltd.
- Bonded body22 May 2025US 2025/0162950 A1NGK Insulators, Ltd.
- Methods of preparing metal sheets for a dcb / dab substrate bonding process17 Apr 2025US 2025/0121587 A1Littelfuse, Inc.
- Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same13 Feb 2025US 2025/0050439 A1Watlow Electric Manufacturing Company
Most cited
By later US patents
- Ceramic circuit board with heat sink53US 6,033,787 AMitsubishi Materials Corporation · 2000
- Method of surface bonding materials together by use of a metal matrix composite, and products produced thereby39US 5,004,034 ALanxide Technology Company, LP · 1991
- Braze for silicon carbide bodies33US 5,447,683 AGeneral Atomics · 1995
- Polycrystalline diamond compacts and related products29US 9,272,392 B2US Synthetic Corporation · 2016
- Ceramic circuit board27US 6,426,154 B1Kabushiki Kaisha Toshiba · 2002