Electric circuit board and power module
AssigneeKYOCERA Corporation
InventorYoshitada Konishi
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Abstract
An electric circuit board includes an insulating substrate, a metal plate, and a brazing material with which the insulating substrate and the metal plate are joined together. The metal plate has a side surface over which recessed portions are scattered. The side surface of the metal plate has lines in regions around the recessed portions. The metal plate is made of copper or a copper alloy. The brazing material has a side surface that is continuous with the side surface of the metal plate. The brazing material is a silver-copper brazing alloy. A ratio of copper on the side surface of the brazing material is higher than a copper component ratio of the silver-copper brazing alloy.
Claims8
An electric circuit board comprising an insulating substrate, a metal plate, and a brazing material with which the insulating substrate and the metal plate are joined together,
- wherein the metal plate has a side surface over which a plurality of recessed portions are scattered,
- wherein a side surface of the brazing material is continuous with the side surface of the metal plate, and the side surface of the brazing material and the side surface of the metal plate form a single concave surface, and
- wherein the side surface of the metal plate has grooves in regions around the recessed portions.
Dependencies are inferred from the claim text.