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AssigneeMitsubishi Materials Corporation
InventorsToshiyuki Nagase, Yoshirou Kuromitsu, Kunio Sugamura, Yoshio Kanda, Masafumi Hatsushika, Masato Otsuki
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A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.
A ceramic circuit board with a heat sink, comprising:
A ceramic circuit board with a heat sink which includes a multilayer structure formed by laminating and bonding first and second plates made of one of aluminum and copper onto opposite sides of a ceramic substrate, said structure being bonded to a heat sink through said first plate, wherein:
Dependencies are inferred from the claim text.