Methods of preparing metal sheets for a DCB / DAB substrate bonding process
AssigneeLittelfuse, Inc.
InventorThomas Spann
Life of this patent
Estimating the term…
Abstract
Novel methods of preparing a metal bonded substrate. A method may include providing a ceramic substrate, the ceramic substrate comprising a ceramic body. The method may include bonding a thick metal sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a metal surface, and bringing the ceramic substrate and thick metal sheet together, wherein the metal oxide layer and the thick metal sheet interact to form an interface layer between the thick metal sheet and the ceramic substrate, after the bonding.
Claims8
A method of preparing a metal bonded substrate, comprising:
- providing a ceramic substrate, the ceramic substrate comprising a ceramic body;
- and
- bonding a thick metal sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a metal surface, and bringing the ceramic substrate and thick metal sheet together, wherein the metal oxide layer and the thick metal sheet interact to form an interface layer between the thick metal sheet and the ceramic substrate, after the bonding;
- wherein the metal surface is a first main surface of the thick metal sheet and wherein the powder deposition process comprises spraying a powder onto the first main surface to form the metal oxide layer:
- wherein bringing the ceramic substrate and thick metal sheet together comprises, after the spraying the powder, applying the first main surface to the ceramic substrate at elevated temperature;
- and
- wherein spraying of the powder comprises spraying a metallic powder onto the first main surface in an oxidizing ambient, wherein the metallic powder is oxidized during the spraying.
A method of preparing a direct copper bonded (DCB) substrate, comprising:
- providing a ceramic substrate, the ceramic substrate comprising a ceramic body;
- and
- bonding a thick copper sheet to the ceramic substrate, wherein the bonding comprises forming a metal oxide layer by powder deposition on a copper surface, and bringing the ceramic substrate and thick copper sheet together, wherein the metal oxide layer and the thick copper sheet interact to form an interface layer between the thick copper sheet and the ceramic substrate, after the bonding;
- wherein the copper surface is a first main surface of the thick copper sheet and wherein the powder deposition process comprises spraying a powder onto the first main surface to form the metal oxide layer;
- wherein bringing the ceramic substrate and thick copper sheet together comprises, after the spraying the powder, applying the first main surface to the ceramic substrate at elevated temperature;
- and
- wherein spraying of the powder comprises spraying a metallic powder onto the first main surface in an oxidizing ambient, wherein the metallic powder is oxidized during the spraying.
Dependencies are inferred from the claim text.