Method for manufacturing bonded body and method for manufacturing insulation circuit substrate
AssigneeMitsubishi Materials Corporation
InventorsRyohei Yumoto, Takeshi Kitahara
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AssigneeMitsubishi Materials Corporation
InventorsRyohei Yumoto, Takeshi Kitahara
Estimating the term…
When a laminate of a plurality of different materials including a metal plate is bonded in a pressurized and heated state, a first pressurizing member in which a first metal foil/a carbon sheet or a ceramic sheet/a graphite sheet are laminated in this order is arranged so that the first metal foil is in contact with a surface of the first metal plate of the laminate, the first metal foil is made of a material that does not react at a contact surface of the first plate member and the first metal foil when heating, and a product of a Young's modulus (GPa) and a thickness (mm) of the first metal foil is 0.6 or more and 100 or less, so that a good bonded body can be manufactured by evenly pressurizing the laminate and foreign substances can be restrained from adhering to the surface of the laminate.
A method for manufacturing a bonded body manufacturing a bonded body heating a laminate of a first plate member and a second plate member while pressurizing, wherein
Dependencies are inferred from the claim text.