Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making same

A method for joining of ceramic pieces, the method comprising:

• applying a layer of titanium on a first ceramic piece;
• applying a layer of titanium on a second ceramic piece;
• applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece;
• applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece;
• assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween;
• pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece;
• heating the first ceramic piece and the second ceramic piece, with the layers of titanium, nickel, and nickel phosphorous, to a joining temperature in a vacuum;
• and
• cooling the first ceramic piece and the second ceramic piece, with the layers of titanium, nickel, and nickel phosphorous,
• wherein a hermetic seal is formed between the first ceramic piece and the second ceramic piece.