Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate

A method for manufacturing a bonded body including a ceramic member formed of ceramics and a Cu member formed of Cu or a Cu alloy, the method comprising:

• a laminating step of laminating the ceramic member and the Cu member through a Cu—P based brazing material and a Ti material;
• and
• a heat treatment step of performing heating at a temperature equal to or higher than a melting start temperature of the Cu—P-based brazing material so as to generate a liquid phase,
• wherein the Cu—P based brazing material contains:
• P of 3 mass % or more and 10 mass % or less;
• optionally Sn of 0.5 mass % or more and 25 mass % or less;
• optionally at least one of elements among Ni, Cr, Fe, and Mn of 2 mass % or more and 20 mass % or less;
• and
• a balance of Cu,
• the Ti material contains Ti,
• in the laminating step, the Cu—P-based brazing material and the Ti material are disposed such that an atomic ratio [Ti/P] of Ti to P interposed between the ceramic member and the Cu member falls into a range equal to or higher than 0.1 and equal to or lower than 0.8, and
• in the heat treatment step, a heating rate is within a range equal to or higher than 5° C./min and equal to or lower than 30° C./min.