C04B 2237/127
The active component for bonding being a refractory metal
C04B2237/127 (The active component for bonding being a refractory metal) appears on 299 US grants and 221 published applications in this corpus.
Search patents in C04B- Granted patents
- 299
- Published applications
- 221
- Assignees
- 124
- Inventors
- 548
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 2 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 3 | 0 |
| 1985 | 2 | 0 |
| 1986 | 9 | 0 |
| 1987 | 7 | 0 |
| 1988 | 5 | 0 |
| 1989 | 7 | 0 |
| 1990 | 7 | 0 |
| 1991 | 19 | 0 |
| 1992 | 7 | 0 |
| 1993 | 7 | 0 |
| 1994 | 6 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 8 | 0 |
| 2001 | 4 | 2 |
| 2002 | 5 | 3 |
| 2003 | 2 | 3 |
| 2004 | 2 | 5 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 3 | 0 |
| 2008 | 2 | 4 |
| 2009 | 0 | 1 |
| 2010 | 2 | 4 |
| 2011 | 1 | 0 |
| 2012 | 3 | 9 |
| 2013 | 3 | 12 |
| 2014 | 6 | 13 |
| 2015 | 9 | 12 |
| 2016 | 9 | 20 |
| 2017 | 13 | 14 |
| 2018 | 11 | 8 |
| 2019 | 16 | 8 |
| 2020 | 11 | 12 |
| 2021 | 7 | 14 |
| 2022 | 11 | 24 |
| 2023 | 10 | 20 |
| 2024 | 19 | 12 |
| 2025 | 13 | 14 |
| 2026 | 7 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bonded body, ceramic-copper circuit board, and semiconductor device26 May 2026US 12,642,091 B2Niterra Materials Co., Ltd.
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,268 B2Mitsubishi Materials Corporation
- Copper/ceramic bonded body and insulating circuit substrate5 May 2026US 12,622,269 B2Mitsubishi Materials Corporation
- Insulating substrate and manufacturing method thereof21 Apr 2026US 12,610,816 B2Dowa Metaltech Co., Ltd.
- Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method13 Aug 2026US 2026/0239541 A1
- Method for producing a pressure sensor6 Aug 2026US 2026/0227258 A1Endress + Hauser GmbH + Co. KG
- Silicon nitride sintered body, silicon nitride substrate, silicon nitride circuit board, and semiconductor device16 Jul 2026US 2026/0200804 A1Niterra Materials Co., Ltd.
- Metal-ceramic substrate and electronic component comprising a metal-ceramic substrate4 Jun 2026US 2026/0157178 A1
- Ceramic substrate, ceramic circuit board, semiconductor device, method for producing slurry, and method for applying release agent1 Jan 2026US 2026/0001819 A1Niterra Materials Co., Ltd.
Most cited
By later US patents
- Brazed thermally-stable polycrystalline diamond compact workpieces and their fabrication143US 4,899,922 AGeneral Electric Company · 1990
- Microwave technique for brazing materials111US 6,054,693 ACalifornia Institute of Technology · 2000
- Thermally stable diamond compacts106US 4,670,025 A1987
- Brazing of diamond film to tungsten carbide105US 5,738,698 ASaint-Gobain/Norton Industrial Ceramics Corporation · 1998
- Laser brazing for ceramic-to-metal joining104US 5,407,119 AAmerican Research Corporation of Virginia · 1995