C04B 2237/122
Based on refractory metals
Official title: based on refractory metals
C04B2237/122 (Based on refractory metals) appears on 413 US grants and 308 published applications in this corpus.
Search patents in C04B- Granted patents
- 413
- Published applications
- 308
- Assignees
- 217
- Inventors
- 879
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 7 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 5 | 0 |
| 1982 | 2 | 0 |
| 1983 | 5 | 0 |
| 1984 | 2 | 0 |
| 1985 | 3 | 0 |
| 1986 | 6 | 0 |
| 1987 | 9 | 0 |
| 1988 | 12 | 0 |
| 1989 | 13 | 0 |
| 1990 | 10 | 0 |
| 1991 | 20 | 0 |
| 1992 | 16 | 0 |
| 1993 | 9 | 0 |
| 1994 | 11 | 0 |
| 1995 | 5 | 0 |
| 1996 | 6 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 8 | 0 |
| 2000 | 11 | 0 |
| 2001 | 9 | 5 |
| 2002 | 12 | 22 |
| 2003 | 15 | 14 |
| 2004 | 8 | 16 |
| 2005 | 10 | 9 |
| 2006 | 8 | 7 |
| 2007 | 5 | 7 |
| 2008 | 5 | 4 |
| 2009 | 4 | 8 |
| 2010 | 6 | 17 |
| 2011 | 4 | 7 |
| 2012 | 14 | 23 |
| 2013 | 9 | 12 |
| 2014 | 9 | 12 |
| 2015 | 14 | 15 |
| 2016 | 8 | 24 |
| 2017 | 17 | 24 |
| 2018 | 12 | 8 |
| 2019 | 15 | 11 |
| 2020 | 11 | 7 |
| 2021 | 7 | 9 |
| 2022 | 6 | 13 |
| 2023 | 6 | 14 |
| 2024 | 12 | 10 |
| 2025 | 9 | 6 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper/ceramic assembly and insulating circuit substrate12 May 2026US 12,628,646 B2Mitsubishi Materials Corporation
- Laminate for circuit board21 Apr 2026US 12,610,461 B2Tokuyama Corporation
- Cutting tool7 Apr 2026US 12,594,599 B2AB Sandvik Coromant
- Corrosion-resistant components3 Mar 2026US 12,567,564 B2CoorsTek, Inc.
- Multi-layer ceramic plate device24 Feb 2026US 12,558,734 B2Watlow Electric Manufacturing Company
- Heat Dissipation Substrate for a Power Semiconductor Module, Manufacturing Method thereof, and Convertor including the same13 Aug 2026US 2026/0239967 A1Lx Semicon Co., Ltd.
- Heat Dissipation Substrate for Power Semiconductor, Power Semiconductor Module including the same, Power Convertor including the same, and Manufacturing method thereof13 Aug 2026US 2026/0239968 A1Lx Semicon Co., Ltd.
- Insulating circuit board and semiconductor device in which same is used4 Jun 2026US 2026/0156744 A1Niterra Materials Co., Ltd.
- Graphite-Based Infrastructures for Handling Molten Metals and Methods of Forming Thereof14 May 2026US 2026/0132090 A1Fourth Power, Inc.
- Copper/ceramic bonded body and insulated circuit board27 Nov 2025US 2025/0365859 A1Mitsubishi Materials Corporation
Most cited
By later US patents
- Multilayer coated abrasive element for bonding to a backing162US 5,049,164 ANorton Company · 1991
- Thermally stable diamond abrasive compact body157US 4,940,180 A1990
- Composite material bonded by an amorphous metal, and preparation thereof152US 4,621,031 ADresser Industries, Inc. · 1986
- Methods for hermetically sealing ceramic to metallic surfaces and assemblies incorporating such seals130US 6,221,513 B1Pacific Coast Technologies, Inc. · 2001
- Living hard tissue replacement, its preparation127US 5,125,971 ATDK Corporation · 1992